Heat sink with multiple vapor chambers

Abstract

A heat sink is disclosed. The heat sink comprises a base ( 102, 402 ) with at least one vapor chamber ( 208, 408 ) containing a fluid with a first activation point. The base has at least one vapor chamber ( 212, 412 ) containing a fluid with a second activation point. The first activation point is different than the second activation point.

1 . A heat sink, comprising:
 a base;   at least one vapor chamber inside the base having a fluid with a first activation point;   at least one vapor chamber inside the base having a fluid with a second activation point wherein the first activation point is different than the second activation point.   
     
     
         2 . The heat sink of  claim 1 , wherein the fluid with the first activation point and the fluid with the second activation point are the same fluid. 
     
     
         3 . The heat sink of  claim 1 , wherein a volume of the least one vapor chamber inside the base having a fluid with a first activation point is larger than a volume of the at least one vapor chamber inside the base having a fluid with a second activation point. 
     
     
         4 . The heat sink of  claim 1 , wherein the first activation point is higher than the second activation point. 
     
     
         5 . The heat sink of  claim 1 , wherein the at least one vapor chamber inside the base having a fluid with a second activation point is contained inside the at least one vapor chamber inside the base having a fluid with a first activation point. 
     
     
         6 . The heat sink of  claim 1 , wherein the at least one vapor chamber inside the base having a fluid with a second activation point is comprised of at least one heat pipe. 
     
     
         7 . The heat sink of  claim 1 , wherein the at least one vapor chamber inside the base having a fluid with a first activation point is comprised of at least one heat pipe. 
     
     
         8 . The heat sink of  claim 1 , wherein: the first activation point is between 60 and 80 degrees C. and the second activation point is between 35 and 65 degrees C. 
     
     
         9 . The heat sink of  claim 1 , further comprising:
 a least one vapor chamber inside the base having a fluid with a third activation point wherein the third activation point is different than the first or second activation point.   
     
     
         10 . A method for cooling a component, comprising:
 activating a fluid, inside a first vapor chamber in a heat sink mounted on the component, at a first temperature;   activating a fluid, inside a second vapor chamber in the heat sink mounted on the component, at a second temperature, wherein the first temperature is different than the second temperature.   
     
     
         11 . The method for cooling a component of  claim 10 , wherein the fluid inside the first vapor chamber is a different fluid than the fluid inside the second vapor chamber. 
     
     
         12 . The method for cooling a component of  claim 10 , wherein a volume of the first vapor chamber is larger than a volume of the second vapor chamber. 
     
     
         13 . The method for cooling a component of  claim 10 , wherein the first vapor chamber and the second vapor chamber are heat pipes. 
     
     
         14 . The method for cooling a component of  claim 10 , wherein the second vapor chamber is broken into at least two parts. 
     
     
         15 . The method for cooling a component of  claim 10 , further comprising:
 activating a fluid inside a third vapor chamber in the heat sink mounted on the component at a third temperature, wherein the third temperature is different than the first or second temperature.