Thermal flex contact carriers #2

Abstract

The present invention relates generally to permanent interconnections between electronic devices, such as integrated circuit packages, chips, wafers and printed circuit boards or substrates, or similar electronic devices. More particularly it relates to high-density electronic devices. The invention describes means and methods that can be used to counteract the undesirable effects of thermal cycling and thermal fluctuations. The invention more specifically shows certain improvements related to its mother patent application, called Thermal Flex Contact Carrier (TFCC), where the improvements allow the height of the contact elements to be now not restricted anymore by the size of the spaces or distances between the contact pads of the devices to be attached together. Certain improvements to the carrier wafer are also shown.

1 . An improved TFCC, wherein
 the length of the stem of the contact elements is not restricted anymore by the spaces or distances between the contact pads of the devices to be attached.   
     
     
         2 . A carrier wafer wherein
 the body of the wafer which carries the contact elements can double up as a solder mask as well.