Bonding pad for anti-peeling property and method for fabricating the same

Abstract

A bonding pad includes a conductive layer formed over an insulation layer, and a dummy pattern penetrating the insulation layer and stuck in the conductive layer, wherein a bonding process is performed.

1 . A bonding pad, comprising:
 dummy patterns;   an insulation layer that covers the dummy patterns;   a recess pattern formed by selectively etching the insulation layer, wherein upper portions of the dummy patterns are protruded from the etched insulation layer, and wherein the etched insulation layer remains between lower portions of the dummy patterns; and   a conductive pattern that covers the dummy patterns to fill spaces between the protruding upper portions of the dummy patterns to form the conductive pattern and the dummy patterns in direct physical contact,   wherein the conductive pattern is later used in a bonding process.   
     
     
         2 . The bonding pad of  claim 1 , further comprising an adhesion layer formed on sidewalls of the recess pattern. 
     
     
         3 . The bonding pad of  claim 2 , wherein the adhesion layer is formed to have a spacer shape. 
     
     
         4 . The bonding pad of  claim 1 , wherein the dummy patterns has are formed in a matrix shape, the matrix shape having a plurality of slits therein. 
     
     
         5 . The bonding pad of  claim 1 , wherein the dummy patterns protrude approximately 25% to approximately 75% of a vertical height of the dummy patterns above the surface of the etched insulation layer disposed between the dummy patterns. 
     
     
         6 . The bonding pad of  claim 1 , wherein each of the conductive pattern, the dummy patterns and the adhesion layer includes a metal layer. 
     
     
         7 . The bonding pad of  claim 1 , wherein each of the conductive pattern, the dummy patterns and the adhesion layer includes one selected from a group consisting of an aluminum (Al) layer, a copper (Cu) layer, and a tungsten (W) layer.