Coupler apparatus

Abstract

According to one embodiment, a coupler apparatus includes a coupling element and a ground plane. The coupling element comprises a conductive material and configured to be subjected to power feeding to a feeding point. The ground plane comprises a conductive material and faces the coupling element. The coupling element has one or more through holes along an alignment direction of the coupling element and the ground plane.

1 . A coupler apparatus comprising:
 a coupling element comprising a conductive material, the coupling element configured to receive power at a feeding point; and   a ground plane comprising a conductive material and facing at least a portion of the coupling element,   wherein the coupling element comprises one or more through holes along an alignment direction of the coupling element and the ground plane.   
     
     
         2 . The apparatus of  claim 1 , wherein one or more of the through holes comprises an opening area smaller than the coupling element. 
     
     
         3 . The apparatus of  claim 1 , further comprising a dielectric between the coupling element and the ground plane, the dielectric facing at least a portion of the coupling element and the ground plane. 
     
     
         4 . The apparatus of  claim 3 , wherein the dielectric comprises one or more holes aligned with one or more through holes formed in the coupling element. 
     
     
         5 . The apparatus of  claim 4 , wherein the one or more holes formed in the dielectric are pierced through the dielectric in a direction along which the dielectric faces at least a portion of the coupling element. 
     
     
         6 . A coupler apparatus comprising:
 a coupling element comprising a resonant stub, the resonant stub comprising a conductive material; and   a ground plane comprising a conductive material, the ground plane facing at least a portion of the coupling element,   wherein the resonant stub comprises one or more through holes along an alignment direction of the coupling element and the ground plane.   
     
     
         7 . The apparatus of  claim 6 , wherein the through holes of the resonant stub each comprise an opening area smaller than the resonant stub. 
     
     
         8 . The apparatus of  claim 6 , further comprising a dielectric between the resonant stub and the ground plane, the dielectric facing at least a portion of the resonant stub and the ground plane. 
     
     
         9 . The apparatus of  claim 8 , wherein the dielectric comprises one or more holes aligned with one or more through holes formed in the resonant stub. 
     
     
         10 . The apparatus of  claim 9 , wherein the one or more holes or the holes formed in the dielectric are pierced through the dielectric in a direction along which the dielectric faces at least a portion of the resonant stub. 
     
     
         11 . The apparatus of  claim 8 , wherein the dielectric comprises, in an area facing the resonant stub, a plurality of holes each having an opening area smaller than the area facing at least a portion of the resonant stub. 
     
     
         12 . A coupler apparatus comprising:
 a coupling element comprising a conductive material, the coupling element configured to receive power at a feeding point;   a ground plane comprising a conductive material and facing at least a portion of the coupling element; and   a dielectric between the coupling element and the ground plane, the dielectric facing at least a portion of the coupling element and the ground plane,   wherein a thickness of a region of the dielectric facing at least a portion of the coupling element is smaller than that in any other region of the dielectric, the thickness in a direction along which the coupling element faces at least a portion of the dielectric.