US2012018864A1PendingUtilityA1

Bonding structure and method

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Assignee: KRISHNAN SHUTESHPriority: Jul 21, 2010Filed: Oct 11, 2010Published: Jan 26, 2012
Est. expiryJul 21, 2030(~4 yrs left)· nominal 20-yr term from priority
Inventors:Shutesh KrishnanYun Sung Won
H10W 99/00H10W 90/766H10W 90/756H10W 90/754H10W 90/736H10W 90/734H10W 90/732H10W 90/724H10W 74/00H10W 72/07354H10W 72/07352H10W 72/07332H10W 72/07331H10W 72/07311H10W 72/01365H10W 72/01325H10W 72/01323H10W 72/886H10W 72/884H10W 72/354H10W 72/352H10W 72/351H10W 72/347H10W 72/325H10W 72/321H10W 72/075H10W 72/073H10W 72/30H10W 72/60H10W 70/466H10W 70/63H10W 72/871H10W 72/07636H10W 72/07631H10W 72/07633H10W 72/07635H10W 72/07632H10W 70/417
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Claims

Abstract

A bonding structure and a method for bonding components, wherein the bonding structure includes a nanoparticle preform. In accordance with embodiments, the nanoparticle preform is placed on a substrate and a workpiece is placed on the nanoparticle preform.

Claims

exact text as granted — not AI-modified
1 . A method for bonding components, comprising:
 providing a nanoparticle preparation; and   compacting the nanoparticle preparation.   
     
     
         2 . The method of  claim 1 , wherein providing the nanoparticle preparation includes suspending nanoparticles in a liquid. 
     
     
         3 . The method of  claim 2 , wherein suspending the nanoparticles in the liquid includes suspending the nanoparticles in an organic solvent. 
     
     
         4 . The method of  claim 2 , wherein suspending the nanoparticles in the liquid includes suspending the nanoparticles in an aqueous solution. 
     
     
         5 . The method of  claim 1 , wherein the nanoparticle preparation comprises nanoparticles. 
     
     
         6 . The method of  claim 5 , wherein compacting the nanoparticle preparation forms a nanoparticle structure and further including mounting the nanoparticle structure to a substrate and mounting a semiconductor chip to the nanoparticle structure. 
     
     
         7 . The method of  claim 1 , wherein compacting the nanoparticle preparation comprises applying a pressure to the nanoparticle preparation. 
     
     
         8 . The method of  claim 1 , wherein applying pressure to the nanoparticle preparation includes applying one of mechanical pressure or pneumatic pressure. 
     
     
         9 . The method of  claim 1 , wherein compacting the nanoparticle preparation includes applying ultrasonic energy to the nanoparticle preparation. 
     
     
         10 . The method of  claim 1 , wherein providing the nanoparticle preparation includes providing the nanoparticle preparation as a nanoparticle suspension and further including applying the nanoparticle suspension to a substrate and driving off the solvent from the nanoparticle suspension and wherein compacting the nanoparticles preparation forms a nanoparticle structure. 
     
     
         11 . The method of  claim 10 , further including mounting a semiconductor chip to the nanoparticle structure. 
     
     
         12 . The method of  claim 11 , wherein applying the nanoparticle suspension to the substrate includes applying the nanoparticle suspension to a printed circuit board. 
     
     
         13 . The method of  claim 11 , wherein applying the nanoparticle suspension to the substrate includes applying the nanoparticle suspension to a leadframe. 
     
     
         14 . The method of  claim 1 , wherein compacting the nanoparticle preparation includes applying at least one of a magnetic pulse, pressure, or ultrasonic energy to the nanoparticle preparation. 
     
     
         15 . The method of  claim 1 , wherein providing the nanoparticle preparation includes providing the nanoparticle preparation as nanoparticles and further including applying the nanoparticles to a substrate to form a nanoparticle structure, and wherein compacting the nanoparticle preparation forms a nanoparticle structure. 
     
     
         16 . A component, comprising:
 a support structure having a surface; and   a nanoparticle preform disposed on the support structure.   
     
     
         17 . The component of  claim 16 , wherein the support structure is a leadframe flag. 
     
     
         18 . The component of  claim 16 , wherein the support structure is a printed circuit board. 
     
     
         19 . The component of  claim 16 , wherein the nanoparticle preform comprises material derived from a precursor comprising metallic particles. 
     
     
         20 . The component of  claim 16 , further including one of a semiconductor chip or a wafer in contact with the nanoparticle preform.

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