Methods and apparatuses for adaptively controlling antenna parameters to enhance efficiency and maintain antenna size compactness

Abstract

A modular communications apparatus. The apparatus comprises a dielectric substrate, a radiating structure disposed on a surface of the substrate, and an electronics module disposed within the dielectric substrate. The electronics module comprises a power amplifier and signal receiving components. The apparatus further comprises fixed length transmission lines connecting the radiating structure and the electronics module, a length of each transmission line selected to present a desired impedance at an input and an output terminal of each transmission line without requiring separate impedance matching elements.

1 . A modular communications apparatus comprising:
 a dielectric substrate;   a radiating structure disposed on a surface of the substrate;   an electronics module disposed within the dielectric substrate, the electronics module comprising:
 a power amplifier; 
 signal receiving components; 
   fixed length transmission lines connecting the radiating structure and the electronics module, a length of each transmission line selected to present a desired impedance at an input and an output terminal of each transmission line without requiring separate impedance matching elements.   
     
     
         2 . The modular communications apparatus of  claim 1  wherein the desired impedance is less than 50 ohms. 
     
     
         3 . The modular communications apparatus of  claim 1  wherein the desired impedance comprises an output impedance for matching an output impedance of the power amplifier or the signal receiving components to which the transmission line is connected. 
     
     
         4 . The modular communications apparatus of  claim 1  further comprising a fiber optics element for supplying signals to and receiving signals from the electronics module. 
     
     
         5 . The modular communications apparatus of  claim 1  wherein each fixed length transmission line presents a fixed phase shift over a transmission line length. 
     
     
         6 . The modular communications apparatus of  claim 1  wherein a material of the dielectric substrate comprises one of organic laminate material, printed circuit board material, and flex film material. 
     
     
         7 . The modular communications apparatus of  claim 1  wherein the electronics module further comprises an impedance controller disposed between the power amplifier and the radiating structure for controlling an impedance seen by the power amplifier, the impedance controller responsive to a power-related parameter. 
     
     
         8 . The modular communications apparatus of  claim 1  wherein the radiating structure comprises a high band antenna and a low band antenna. 
     
     
         9 . The modular communications apparatus of  claim 8  wherein the power amplifier comprises a high band power amplifier for supplying signals to the high band antenna and a low band power amplifier for supplying signals to the low band antenna. 
     
     
         10 . The modular communications apparatus of  claim 8  wherein the high band comprises a first frequency band between about 824 and 960 MHz and the low band comprises a second frequency band between about 1710 and 1990 MHz. 
     
     
         11 . The modular communications apparatus of  claim 9  wherein the electronics module further comprises an RF switch for switching between the high band antenna and the low band antenna. 
     
     
         12 . The modular communications apparatus of  claim 1  wherein the radiating structure comprises a length of conductive material disposed on one or more surfaces of the dielectric substrate. 
     
     
         13 . The modular communications apparatus of  claim 1  wherein the electronics module further comprises frequency tuning for controlling operating parameters of the radiating structure. 
     
     
         14 . The modular communications apparatus of  claim 1  wherein dimensions of the dielectric substrate are about 28 mm long, 15 mm wide and 7 mm high. 
     
     
         15 . The modular communications apparatus of  claim 1  wherein the radiating structure transmits and receives signals. 
     
     
         16 . The modular communications apparatus of  claim 1  wherein the signal receiving components comprise a low noise amplifier. 
     
     
         17 . The modular communications apparatus of  claim 1  wherein the signal receiving components comprise a first low noise amplifier responsive to a first impedance controlling circuit and a second low noise amplifier responsive to a second impedance controlling circuit. 
     
     
         18 . The modular communications apparatus of  claim 1  wherein the radiating structure comprises a meanderline antenna. 
     
     
         19 . The modular communications apparatus of  claim 1  further comprising a carrier, wherein the dielectric substrate is mounted on the carrier. 
     
     
         20 . A method for manufacturing a plurality of communications apparatus modules, comprising:
 providing a dielectric substrate;   forming a radiating structure on the substrate;   forming receiving and transmitting components within the substrate;   determining an impedance of the receiving and transmitting components; and   forming transmission lines within the substrate for interconnecting the radiating structure and the receiving and transmitting components, transmission line lengths selected to match the impedance of the receiving and transmitting components.