Manufacturing method of display device and mold therefor

Abstract

A method of manufacturing a display device in which a film deposited on a substrate through openings in a covering layer is easily removed from the covering layer, is described herein, includes forming a master layer having a predetermined pattern of openings on a base substrate; spraying a light shielding material on the master layer; fabricating a mold provided with the light shielding film by forming a moldable material layer on the base substrate and the master layer; curing the moldable material layer and the light shielding material; arranging, pressurizing, and exposing the mold on an insulation substrate having a photosensitive film formed thereon after separating the mold from the master layer; and developing the photosensitive film after separating the mold from the insulation substrate.

1 . A manufacturing method of a display device, the method comprising:
 providing a base substrate;   forming on the substrate a master layer provided with a predetermined pattern of openings exposing portions of the base substrate;   treating the surfaces of the master layer and the base substrate exposed through the opening of the master layer with a reagent; and   supplying a first material inside the openings, the reagent surface treatment causing the difference of interface tensions between the master layer and the supplied first material to be smaller than the interface tension between the supplied first material and the substrate.   
     
     
         2 . The method according to  claim 1  wherein the first material is light shielding material. 
     
     
         3 . The method according to  claim 2 , wherein the surface treatment includes an O 2 /CF 4  plasma treatment and a self-assembly monolayer (SAM) treatment. 
     
     
         4 . The method according to  claim 3 , wherein a decrement of the interface tension of the base substrate is larger than that of the interface tension of the master layer through the O 2 /CF 4  plasma treatment and the SAM treatment. 
     
     
         5 . The method according to  claim 3 , wherein the level of the interface tension of the base substrate becomes close to that of the interface tension of the light shielding material through the surface treatment. 
     
     
         6 . A mold comprising:
 a pattern forming layer having at least one or more projections; and   a light shielding film formed at the end of the projection.   
     
     
         7 . The mold according to  claim 6 , wherein the pattern forming layer is made of a transparent material through which ultraviolet light is transmitted, and the light shielding film is made of a material for shielding ultraviolet light. 
     
     
         8 . The mold according to  claim 7 , wherein the pattern forming layer includes PDMS (Polydimethylsiloxane). 
     
     
         9 . A mold comprising:
 a supporting layer;   a pattern forming layer which is formed on a first surface of the supporting layer and has at least one projection,; and   a light shielding film which is formed on a second surface of the supporting layer and located in a region corresponding to the projection.   
     
     
         10 . The mold according to  claim 9 , wherein the supporting layer includes at least one of PET (Polyethylene Terephthalate) and PC (Polycarbonate). 
     
     
         11 . The mold according to  claim 9 , wherein each of the pattern forming layer and the supporting layer is made of a transparent material through which ultraviolet light is transmitted, and the light shielding film is made of a material for shielding ultraviolet light. 
     
     
         12 . The mold according to  claim 9 , further comprising a buffer layer positioned between the supporting layer and the light shielding film. 
     
     
         13 . The mold according to  claim 9 , further comprising a buffer layer covering the light shielding film. 
     
     
         14 . The mold according to  claim 13 , wherein the buffer layer is made of the same material as the pattern forming layer. 
     
     
         15 . The mold according to  claim 12 , further comprising a buffer layer covering the light shielding film. 
     
     
         16 . The mold according to  claim 15 , wherein the buffer layer is made of the same material as the pattern forming layer.