Thermosyphon for cooling electronic components

Abstract

A thermosyphon including an evaporator section, a condenser section coupled to the evaporator section, and a condensate guide lining an inner portion of the evaporator section and inner surfaces of the condenser section. The condensate guide defines a vapour core in the evaporator and condenser sections and is configured to return condensate to the evaporator section regardless of an orientation of the thermosyphon.

1 . A thermosyphon, comprising:
 an evaporator section;   a condenser section coupled to the evaporator section; and   a condensate guide lining an inner portion of the evaporator section and inner surfaces of the condenser section, the condensate guide defining a vapour core in the evaporator and condenser sections, wherein the condensate guide is configured to return condensate to the evaporator section regardless of an orientation of the thermosyphon.   
     
     
         2 . The thermosyphon of  claim 1 , wherein the condensate guide includes a plurality of pores, the pores of the condensate guide being sized to allow vapour to pass through and prevent condensate flow through. 
     
     
         3 . The thermosyphon of  claim 1 , further comprising a boiling enhancement structure coupled to the evaporator section. 
     
     
         4 . The thermosyphon of  claim 3 , wherein the boiling enhancement structure comprises a plurality of fins, and wherein a separation between adjacent ones of the fins is less than a bubble characteristic length of a working fluid in the evaporator section. 
     
     
         5 . (canceled) 
     
     
         6 . The thermosyphon of  claim 3 , wherein the boiling enhancement structure is configured to draw the condensate back to the evaporator section. 
     
     
         7 . The thermosyphon of  claim 3 , wherein the boiling enhancement structure is integrally formed with a heat receiving portion of the evaporator section. 
     
     
         8 . The thermosyphon of  claim 7 , further comprising a thermal interface material coupled to the heat receiving portion of the evaporator section. 
     
     
         9 . The thermosyphon of  claim 3 , further comprising a working fluid in the evaporator section, wherein the working fluid is provided in an amount sufficient to submerge the boiling enhancement structure. 
     
     
         10 . The thermosyphon of  claim 9 , wherein the working fluid is in a saturated state. 
     
     
         11 . The thermosyphon of  claim 1 , wherein one of a plurality of grooves and a plurality of knurls are formed on the inner surfaces of the condenser section. 
     
     
         12 . The thermosyphon of  claim 1 , further comprising a port for charging the evaporation section with a working fluid and for deaerating the thermosyphon. 
     
     
         13 . A thermosyphon, comprising:
 an evaporator section;   a condenser section coupled to the evaporator section; and   a boiling enhancement structure coupled to the evaporator section, the boiling enhancement structure comprising a plurality of fins, wherein a separation between adjacent ones of the fins is less than a bubble characteristic length of a working fluid in the evaporator section.   
     
     
         14 . (canceled) 
     
     
         15 . The thermosyphon of  claim 13 , wherein the boiling enhancement structure is configured to draw condensate back to the evaporator section. 
     
     
         16 . The thermosyphon of  claim 13 , wherein the boiling enhancement structure is integrally formed with a heat receiving portion of the evaporator section. 
     
     
         17 . The thermosyphon of  claim 16 , further comprising a thermal interface material coupled to the heat receiving portion of the evaporator section. 
     
     
         18 . The thermosyphon of  claim 13 , further comprising a working fluid in the evaporator section, wherein the working fluid is in a saturated state. 
     
     
         19 . The thermosyphon of  claim 18 , wherein the working fluid is provided in an amount sufficient to submerge the boiling enhancement structure. 
     
     
         20 . The thermosyphon of  claim 13 , wherein one of a plurality of grooves and a plurality of knurls are formed on an inner surface of the condenser section. 
     
     
         21 . The thermosyphon of  claim 13 , further comprising a port for charging the evaporation section with a working fluid and for deaerating the thermosyphon. 
     
     
         22 . The thermosyphon of  claim 13 , further comprising a condensate guide defining a vapour core in the evaporator and condenser sections, wherein the condensate guide is configured to return condensate to the evaporator section regardless of an orientation of the thermosyphon. 
     
     
         23 . The thermosyphon of  claim 22 , wherein the condensate guide includes a plurality of pores, the pores of the condensate guide being sized to allow vapour to pass through and prevent condensate flow through.