Semiconductor device and method for manufacturing the same

Abstract

A semiconductor device according to the present invention includes: a semiconductor layer made of silicon; a trench formed by digging in from a top surface of the semiconductor layer; a gate insulating film formed on an inner wall surface of the trench and made of silicon oxide; a gate electrode embedded in the trench via the gate insulating film and made of a polysilicon doped with an impurity; and an oxidation-resistant metal film disposed on a top surface of the gate electrode and covering the top surface.

1 . A semiconductor device comprising:
 a semiconductor layer made of silicon;   a trench extending in the semiconductor layer from a top surface of the semiconductor layer;   a gate insulating film formed on an inner wall surface of the trench and made of silicon oxide;   a gate electrode embedded in the trench via the gate insulating film and made of a polysilicon doped with an impurity; and   an oxidation-resistant metal film disposed on a top surface of the gate electrode and covering the top surface.   
     
     
         2 . The semiconductor device as set forth in  claim 1 , further comprising a body region and source region, the source region being formed in a top layer portion of the semiconductor layer, extending in a direction along a gate width along the trench and having a bottom portion contacting the body region. 
     
     
         3 . The semiconductor device as set forth in  claim 2 , further comprising a body contact region at a central region of the source region in a direction orthogonal to the gate width, the body contact region penetrating through the source region. 
     
     
         4 . A semiconductor device comprising a matrix of unit cells, each unit cell including the semiconductor layer, trench, gate insulating film, gate electrode, oxidation-resistant metal film, body region and source region, as set forth in  claim 2 , wherein on the source region, a boundary between the unit cells of said matrix that are adjacent in a direction orthogonal to the gate width is set along the source region. 
     
     
         5 . A semiconductor device comprising a matrix of unit cells, each unit cell including the semiconductor layer, trench, gate insulating film, gate electrode, oxidation-resistant metal film, and body contact region, as set forth in  claim 3 , wherein the body contact region extends across two of the unit cells that are adjacent in the direction orthogonal to the gate width. 
     
     
         6 . A semiconductor device comprising a matrix of unit cells, each unit cell including the semiconductor layer, trench, gate insulating film, gate electrode, and oxidation-resistant metal film, as set forth in  claim 1 , wherein a boundary between unit cells of the matrix that are adjacent in the direction along a gate width is set so that the gate electrode contained in each unit cell has a fixed gate width. 
     
     
         7 . The semiconductor device as set forth in  claim 1 , further comprising a substrate, the semiconductor layer being provided on the substrate. 
     
     
         8 . The semiconductor device as set forth in  claim 1 , further comprising an interlayer insulating film laminated on the semiconductor layer. 
     
     
         9 . The semiconductor device as set forth in  claim 8 , further comprising a gate wiring formed on the interlayer insulating film. 
     
     
         10 . The semiconductor device as set forth in  claim 9 , wherein the gate wiring contacts the oxidation-resistant metal film through a contact hole penetrating through the interlayer insulating film in an up/down direction. 
     
     
         11 . The semiconductor device as set forth in  claim 8 , wherein the oxidation-resistant metal film is partly covered with the interlayer insulating film. 
     
     
         12 . The semiconductor device as set forth in  claim 8 , further comprising a source wiring formed on the interlayer insulating film. 
     
     
         13 . The semiconductor device as set forth in  claim 12 , further comprising:
 a body region and a source region, the source region being formed in a top layer portion of the semiconductor layer, extending in a direction along a gate width along the trench and having a bottom portion contacting the body region; and   a body contact region at a central region of the source region in a direction orthogonal to the gate width, the body contact region penetrating through the source region,   wherein the source wiring penetrates through the interlayer insulating film to be electrically connected to the source region and the body contact region.   
     
     
         14 . The semiconductor device as set forth in  claim 7 , further comprising a drain electrode, the substrate having a first surface and a second surface opposite of the first surface, wherein the semiconductor layer is provided on the first surface, and the drain electrode is provided on the second surface. 
     
     
         15 . The semiconductor device as set forth in  claim 7 , wherein the semiconductor layer and the substrate are doped with an impurity, a concentration of the impurity in the semiconductor layer being lower than in the substrate. 
     
     
         16 . The semiconductor device as set forth in  claim 15 , wherein the substrate is of a first conduction type, and a first portion of the semiconductor layer is doped with a lower concentration of a first conduction type impurity than is the substrate. 
     
     
         17 . The semiconductor device as set forth in  claim 16 , wherein a second portion of the semiconductor layer is doped with a second conduction type different from the first conduction type, the second portion being located on the first portion. 
     
     
         18 . The semiconductor device according to  claim 1 , further comprising a gate wiring connected to a central region of a top surface of the oxidation-resistant metal film. 
     
     
         19 . The semiconductor device according to  claim 18 , wherein the gate electrode has a top surface having a recess at a center thereof. 
     
     
         20 . The semiconductor device according to  claim 1 , wherein the trench has a width that expands from a bottom toward a top thereof. 
     
     
         21 . The semiconductor device according to  claim 1 , wherein the oxidation-resistant metal film has a substantially uniform thickness. 
     
     
         22 . The semiconductor device according to  claim 1 , wherein the oxidation-resistant metal film is made of W, Pt, Co, Ni, Ti or Au.