Curable adhesive compositions, process, and applications

Abstract

The invention provides an improvement to the useable lifetimes of phenolic-epoxy, phenolic-benzoxazine, phenolic-epoxy-benzoxazine mixtures and other phenolic mixtures through the use of protected phenolics, where a phenolic compound, polymer, or resin is released on demand by the addition of a deblocking agent.

1 . A composition comprising a protected phenolic compound, where the protected phenolic compound comprises a first and a second aryl glycidyl carbonate moiety. 
     
     
         2 . (canceled) 
     
     
         3 . The composition of  claim 1 , where the first and second aryl glycidyl carbonate moieties are in the same aryl group or in different aryl groups. 
     
     
         4 . (canceled) 
     
     
         5 . The composition of  claim 1 , where the protected phenolic compound is selected from the following aryl glycidyl carbonates: 
       
         
           
           
               
               
           
         
         
           
           
               
               
           
         
       
     
     
         6 . (canceled) 
     
     
         7 . (canceled) 
     
     
         8 . (canceled) 
     
     
         9 . The composition of  claim 1  further comprising:
 an epoxy resin. 
 
     
     
         10 . The composition of  claim 9 , where the epoxy resin is derived from at least one of bisphenol A, bisphenol F, novolac, polyphenol, aniline, polyaniline, or their oligomeric or halogenated derivatives. 
     
     
         11 . The composition of  claim 9 , further comprising:
 0.1 to 90 percent by weight of the protected phenolic compound; and   10 to 99.9 percent by weight of the epoxy resin.   
     
     
         12 . The composition of  claim 9 , further comprising 0.1 to 90 percent by weight of the deblocking agent. 
     
     
         13 . The composition of  claim 12 , where the deblocking agent is an amine, imidazole, triazine, triazole or an imidazole-epoxy adduct. 
     
     
         14 . The composition of  claim 12 , where the deblocking agent is microencapsulated. 
     
     
         15 . The composition of  claim 14 , where the microencapsulated deblocking agent is encapsulated within a polymer shell or a polymer matrix. 
     
     
         16 . (canceled) 
     
     
         17 . The composition of  claim 9 , further comprising one or more elements selected from:
 curing agents and catalysts for epoxides, fillers, surfactants, coupling agents, pigments, dyes, and conducting particles.   
     
     
         18 . The composition of  claim 8  comprising:
 0.1 to 90 percent by weight of a protected phenolic compound comprising an aryl glycidyl carbonate moiety selected from the following: 
 
       
         
           
           
               
               
           
         
         
           
           
               
               
           
         
         10 to 99.9 percent by weight of an epoxy resin derived from at least one of bisphenol A, bisphenol F, novolac, polyphenol, aniline, polyaniline, or their oligomeric or halogenated derivatives; and 
         0.1 to 90 percent by weight of a deblocking agent comprising an amine, imidazole, triazine, triazole or an imidazole-epoxy adduct, the deblocking agent being microencapsulated in a polymeric matrix. 
       
     
     
         19 . The composition of  claim 18 , further comprising 0.1 to 90 weight percent benzoxazine selected from the list including the following benzoxazine compounds: 
       
         
           
           
               
               
           
         
       
     
     
         20 - 23 . (canceled) 
     
     
         24 . An electronic display comprising the composition of  claim 19 . 
     
     
         25 . The electronic display of  claim 24  where the composition is cured, partially cured, or un-cured. 
     
     
         26 - 31 . (canceled) 
     
     
         32 . The composition of  claim 1 , where the composition is a 1-part adhesive composition. 
     
     
         33 . The composition of  claim 32  where the composition shows adhesion at interfaces, low shrinkage on cure, low coefficient of thermal expansion (CTE), and high glass transition on cure. 
     
     
         34 - 71 . (canceled) 
     
     
         72 . The composition of  claim 3  where the composition is a 1-part adhesive. 
     
     
         73 . The composition of  claim 18  where the composition is a 1-part adhesive. 
     
     
         74 . The composition of  claim 19  where the composition is a 1-part adhesive.