US2012032269A1PendingUtilityA1

Semiconductor integrated circuit device and method for fabricating the same

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Assignee: CHANG DONG-RYULPriority: Jun 8, 2005Filed: Oct 13, 2011Published: Feb 9, 2012
Est. expiryJun 8, 2025(expired)· nominal 20-yr term from priority
H10W 20/48H10W 20/47H10D 84/0188H10D 84/0186H10D 84/0181H10D 84/038H10W 42/20
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Abstract

Provided are a semiconductor integrated device and a method for fabricating the same. The semiconductor integrated circuit includes a semiconductor substrate including a first dopant, a first conductive layer pattern formed on the semiconductor substrate, an interlayer dielectric layer formed on the first conductive layer pattern, a second conductive layer pattern formed on the interlayer dielectric layer, and a first vacuum ultraviolet (VUV) blocking layer which blocks a VUV ray radiated to the semiconductor substrate.

Claims

exact text as granted — not AI-modified
1 . A semiconductor integrated circuit comprising:
 a semiconductor substrate including a first dopant;   a first conductive layer pattern formed on the semiconductor substrate, the first conductive layer pattern being a gate electrode of a high voltage driving transistor;   an interlayer dielectric layer formed on the first conductive layer pattern;   a second conductive layer pattern formed on the interlayer dielectric layer; and   a first blocking layer having an insulating property formed conformally on the second conductive layer pattern and the interlayer dielectric layer to block a ray irradiated to the semiconductor substrate.

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