Process for Preparing Conductive Films and Articles Prepared Using the Process

Abstract

A free standing film includes: i. a matrix layer having opposing surfaces, and ii. an array of nanorods, where the nanorods are oriented to pass through the matrix layer and protrude an average distance of at least 1 micrometer through one or both surfaces of the matrix layer. A method for preparing the free standing film includes (a) providing an array of nanorods on a substrate, optionally (b) infiltrating the array with a sacrificial layer, (c) infiltrating the array with a matrix layer, thereby producing an infiltrated array, optionally (d) removing the sacrificial layer without removing the matrix layer, when step (b) is present, and (e) removing the infiltrated array from the substrate to form the free standing film. The free standing film is useful as an optical filter, ACF, or TIM, depending on the type and density of nanorods selected.

1 . A device comprising:
 a) a heat generating component,   b) a thermal interface material, and   c) a thermal management aid;   
       where the thermal interface material is interposed between the heat generating component and the thermal management aid along a thermal path extending from a surface of the heat generating component to a surface of the thermal management aid, where the thermal interface material comprises a free standing film comprising,
 i. a matrix layer having opposing surfaces, and 
 ii. an array of nanorods, where the nanorods are oriented to pass through the matrix layer and protrude an average distance of at least 1 micrometer through one or both surfaces of the matrix layer, and the nanorods contact a surface of the heat generating component and a surface of the thermal management aid. 
 
     
     
         2 . A method comprising interposing a thermal interface material between a heat generating component and a thermal management aid, where the thermal interface material is interposed along a thermal path extending from a surface of the heat generating component to a surface of the thermal management aid, where the thermal interface material comprises a free standing film comprising,
 i. a matrix layer having opposing surfaces, and   ii. an array of nanorods, where the nanorods are oriented to pass through the matrix layer and protrude an average distance of at least 1 micrometer through one or both surfaces of the matrix layer, and the nanorods contact a surface of the heat generating component and a surface of the thermal management aid.   
     
     
         3 . The method of  claim 2 , where the heat generating component comprises a semiconductor die and the thermal management aid comprises a heat sink or a heat spreader.