Semiconductor light emitting devices including an optically transmissive element and methods for packaging the same

Abstract

Methods of packaging a semiconductor light emitting device include dispensing a first quantity of encapsulant material into a cavity including the light emitting device. The first quantity of encapsulant material in the cavity is treated to form a hardened upper surface thereof having a shape. A luminescent conversion element is provided on the upper surface of the treated first quantity of encapsulant material. The luminescent conversion element includes a wavelength conversion material and has a thickness at a middle region of the cavity greater than proximate a sidewall of the cavity.

1 . (canceled) 
     
     
         2 . A method of producing a semiconductor light emitting device, comprising:
 dispensing a first quantity of encapsulant material onto the light emitting device and covering the light emitting device, wherein the first quantity of encapsulant material is substantially free of a wavelength conversion material;   treating the first quantity of encapsulant material on the light emitting device to form an upper surface, the upper surface being displaced from the light emitting device; and   providing an optically transmissive element on the upper surface of the treated first quantity of encapsulant material, the optically transmissive element having a lower surface shape that substantially conforms to the upper surface of the treated encapsulant material, wherein the optically transmissive element includes the wavelength conversion material.   
     
     
         3 . The method of  claim 2 , wherein providing the optically transmissive element comprises:
 dispensing a second quantity of encapsulant material including the wavelength conversion material therein on the upper surface of the treated first quantity of encapsulant material; and   curing the second quantity of encapsulant material to define the optically transmissive element.   
     
     
         4 . The method of  claim 3  wherein the optically transmissive element has a biconvex shape and wherein the shape of the upper surface of the first quantity of encapsulant material is concave and wherein dispensing and curing the second quantity of encapsulant material comprises dispensing and curing the second quantity of encapsulant material to form a convex upper surface of the second quantity of encapsulant material. 
     
     
         5 . The method of  claim 3  wherein the optically transmissive element has a plano-convex shape and wherein the shape of the upper surface of the first quantity of encapsulant material is concave and wherein dispensing and curing the second quantity of encapsulant material comprises dispensing and curing the second quantity of encapsulant material to form a planar upper surface of the second quantity of encapsulant material. 
     
     
         6 . The method of  claim 3  wherein the optically transmissive element has a plano-convex shape and wherein the shape of the upper surface of the first quantity of encapsulant material is planar and wherein dispensing and curing the second quantity of encapsulant material comprises dispensing and curing the second quantity of encapsulant material to form a convex upper surface of the second quantity of encapsulant material. 
     
     
         7 . The method of  claim 3  wherein the optically transmissive element has a concavo-convex shape and wherein the shape of the upper surface of the first quantity of encapsulant material is convex and wherein dispensing and curing the second quantity of encapsulant material comprises dispensing and curing the second quantity of encapsulant material to form a convex upper surface of the second quantity of encapsulant material. 
     
     
         8 . The method of  claim 3  wherein the optically transmissive element has a concavo-convex shape and wherein the shape of the upper surface of the first quantity of encapsulant material is concave and wherein dispensing and curing the second quantity of encapsulant material comprises dispensing and curing the second quantity of encapsulant material to form a concave upper surface of the second quantity of encapsulant material. 
     
     
         9 . The method of  claim 3  wherein treating the first quantity of encapsulant material comprises pre-curing the first quantity of encapsulant material to form a hardened skin on the upper surface thereof and wherein the method further comprises curing the first quantity of encapsulant material after providing the optically transmissive element. 
     
     
         10 . The method of  claim 2  wherein the optically transmissive element comprises a pre-formed insert including the wavelength conversion material and wherein providing the optically transmissive element on the upper surface comprises placing the pre-formed insert on the upper surface of the treated first quantity of encapsulant material. 
     
     
         11 . The method of  claim 2 , wherein the optically transmissive element has a thickness at a middle region of the light emitting device greater than at a region displaced from the middle region of the light emitting device and whererin the thickness of the optically transmissive element continuously decreases as the optically transmissive element extends radially outward from the middle region to the sidewall. 
     
     
         12 . The method of  claim 2 , wherein the optically transmissive element has a thickness at a middle region of the light emitting device greater than at a region displaced from the middle region of the light emitting device and wherein the thickness of the optically transmissive element varies by more than ten percent of a maximum thickness of the optically transmissive element. 
     
     
         13 . The method of  claim 2 , further comprising:
 dispensing a second quantity of encapsulant material onto the optically transmissive element;   positioning a lens on the dispensed second quantity of encapsulant material so that light emitting from the light emitting device passes sequentially through the first quantity of encapsulant material, the optically transmissive element, the second quantity of encapsulant material and the lens before emitting from the packaged semiconductor light emitting device; and   curing the dispensed second quantity of encapsulant material to attach the lens.   
     
     
         14 . A semiconductor light emitting device, comprising:
 a light emitting device;   a first quantity of encapsulant material on the light emitting device;   an optically transmissive element on the first quantity of encapsulant material;   a second quantity of encapsulant material on the optically transmissive element; and   a lens on the second quantity of encapsulant material so that light emitting from the light emitting device passes sequentially through the first quantity of encapsulant material, the optically transmissive element, the second quantity of encapsulant material and the lens before emitting from the packaged semiconductor light emitting device.   
     
     
         15 . The device of  claim 14 , wherein at least one of the second quantity of encapsulant material or the optically transmissive element include a wavelength conversion material and wherein the first quantity of encapsulant material is substantially free of the wavelength conversion material. 
     
     
         16 . The device of  claim 15 , further comprising:
 a substrate; and   a reflector having a cavity therein, wherein the light emitting device as mounted on the substrate and wherein the light emitting device, the first and second quantity of encapsulant material and the optically transmissive element are positioned in the cavity.   
     
     
         17 . The device of  claim 14 , further comprising:
 a substrate; and   a reflector having a cavity therein, wherein the light emitting device as mounted on the substrate and wherein the light emitting device, the first and second quantity of encapsulant material and the optically transmissive element are positioned in the cavity.   
     
     
         18 . A semiconductor light emitting device, comprising:
 a light emitting device;   a first quantity of encapsulant material on the light emitting device;   a second quantity of encapsulant material on the first quantity of encapsulant material;   a third quantity of encapsulant material on the second quantity of encapsulant material.   
     
     
         19 . The device of  claim 18 , wherein the first, second and third quantity of encapsulant material extend over the light emitting device. 
     
     
         20 . The device of  claim 18 , wherein the light emitting device and the first, second and third quantity of encapsulant material are arranged so that light emitting from the light emitting device passes sequentially through the first quantity of encapsulant material, the second quantity of encapsulant material, the third quantity of encapsulant material and the lens before emitting from the packaged semiconductor light emitting device. 
     
     
         21 . The device of  claim 18 , further comprising a wavelength conversion material including in at least one of the second and third quantity of encapsulant material. 
     
     
         22 . The device of  claim 18 , further comprising a wavelength conversion material included in at least one of the first, second, and third quantity of encapsulant material. 
     
     
         23 . The device of  claim 18 , further comprising a substrate, wherein the light emitting device is on the substrate. 
     
     
         24 . The device of  claim 18 , further comprising a lens on the third quantity of encapsulant material. 
     
     
         25 . The device of  claim 18 , wherein the light emitting device includes a plurality of light emitting devices. 
     
     
         26 . The device of  claim 18 , further comprising:
 a substrate; and   a reflector having a cavity therein, wherein the light emitting device is on the substrate and wherein the light emitting device and the first, second and third quantity of encapsulant material are positioned in the cavity.