Copper alloy sheet for electric and electronic parts

Abstract

A Cu—Fe—P alloy sheet that is provided with the high strength and with the improved resistance of peel off of oxidation film, in order to deal with problems such as package cracks and peeling, is provided. A copper alloy sheet for electric and electronic parts according to the present invention is a copper alloy sheet containing Fe: 0.01 to 0.50 mass % and P: 0.01 to 0.15 mass %, respectively, with the remainder of Cu and inevitable impurities. A centerline average roughness Ra is 0.2 μm or less and a maximum height Rmax is 1.5 μm or less, and Kurtosis (degree peakedness) Rku of roughness curve is 5.0 or less, in measurement of the surface roughness of the copper alloy sheet in accordance with JIS B0601.

1 . A copper alloy sheet comprising:
 0.01 to 0.50 mass % of Fe;   0.01 to 0.15 mass % of P; and   a remainder being Cu and inevitable impurities,   wherein a tensile strength of the copper alloy sheet is more than 120 GPa, and a ratio of a uniform elongation to a total elongation is less than 0.50, two measurements being determined by a tensile test using a test piece where a width direction of the copper alloy sheet is a longitudinal direction of the test piece.   
     
     
         2 . The copper alloy sheet of  claim 1 , wherein the tensile strength is 125 GPa or more. 
     
     
         3 . The copper alloy sheet of  claim 1 , wherein the ratio of the uniform elongation to the total elongation is less than 0.45. 
     
     
         4 . The copper alloy sheet of  claim 1 , wherein Fe is included in an amount of 0.15 to 0.35 mass %. 
     
     
         5 . The copper alloy sheet of  claim 1 , wherein P is included in an amount of 0.05 to 0.12 mass %. 
     
     
         6 . The copper alloy sheet of  claim 1 , wherein the copper alloy sheet further comprises 0.005 to 5.0 mass % of Sn. 
     
     
         7 . The copper alloy sheet of  claim 1 , wherein the copper alloy sheet further comprises 0.005 to 3.0 mass % of Zn. 
     
     
         8 . The copper alloy sheet of  claim 1 , wherein contents of S and Pb in the copper alloy sheet are each adjusted to be 20 ppm or less. 
     
     
         9 . The copper alloy sheet of  claim 1 , further comprising:
 a total content of 0.0001 to 1.0 mass % of one or more elements selected from the group consisting of Mn, Mg, and Ca.   
     
     
         10 . The copper alloy sheet of  claim 1 , further comprising:
 a total content of 0.001 to 1.0 mass % of one or more elements selected from the group consisting of Zr, Ag, Cr, Cd, Be, Ti, Co, Ni, Au, and Pt.   
     
     
         11 . The copper alloy sheet of  claim 1 , further comprising:
 a total content of 0.0001 to 1.0 mass % of at least one first element selected from the group consisting of Mn, Mg, and Ca; and   a total content of 0.001 to 1.0 mass % of at least one second element selected from the group consisting of Zr, Ag, Cr, Cd, Be, Ti, Co, Ni, Au, and Pt,   wherein a total content of the first and second elements is 1.0 mass % or less.   
     
     
         12 . The copper alloy sheet of  claim 1 , wherein the copper alloy sheet comprises a total content of 0.1 mass % or less of Hf, Th, Li, Na, K, Sr, Pd, W, S, Si, C, Nb, Al, V, Y, Mo, Pb, In, Ga, Ge, As, Sb, Si, Te, B, and misch metal.