US2012043057A1PendingUtilityA1

Heat-dissipating module

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Assignee: WU CHUN-MINGPriority: Aug 19, 2010Filed: Aug 19, 2010Published: Feb 23, 2012
Est. expiryAug 19, 2030(~4.1 yrs left)· nominal 20-yr term from priority
Inventors:Chun-Ming Wu
F28D 15/0275
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Claims

Abstract

A heat-dissipating module includes a base and at least one heat pipe. The base has a heat-absorbing surface and a heat-conducting surface opposite to the heat-absorbing surface. The heat pipe has a heat-absorbing portion and a heat-dissipating portion. The heat-absorbing portion has a non-planar surface and a planar surface abutting against the heat-conducting surface to be integrally connected therewith. With the integral connection of the base and the heat pipe, the manufacturing procedure is simplified with fewer working steps. Further, the production cost of the heat-dissipating module is saved.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A heat-dissipating module, including:
 a base having a heat-absorbing surface and a heat-conducting surface opposite to the heat-absorbing surface; and   at least one heat pipe having a heat-absorbing portion and a heat-dissipating portion, the heat-absorbing portion having a non-planar surface and a planar surface abutting against the heat-conducting surface to be integrally connected therewith.   
     
     
         2 . The heat-dissipating module according to  claim 1 , wherein the planar surface and the non-planar surface define an accommodating space. 
     
     
         3 . The heat-dissipating module according to  claim 1 , wherein a heat-dissipating space is defined between each of the heat-absorbing portions. 
     
     
         4 . The heat-dissipating module according to  claim 1 , wherein the heat pipes are arranged at intervals or adjacent to each other. 
     
     
         5 . The heat-dissipating module according to  claim 3 , wherein the width of the heat-dissipating space is smaller than the width of the heat pipe. 
     
     
         6 . The heat-dissipating module according to  claim 3 , wherein the width of the heat-dissipating space is equal to the width of the heat pipe. 
     
     
         7 . The heat-dissipating module according to  claim 3 , wherein the width of the heat-dissipating space is larger than the width of the heat pipe. 
     
     
         8 . The heat-dissipating module according to  claim 1 , further comprising a heat sink having a plurality of heat-dissipating fins, the heat-dissipating portions being disposed through the heat-dissipating fins to be integrally connected therewith. 
     
     
         9 . The heat-dissipating module according to  claim 1 , wherein the heat-absorbing surface of the base abuts tightly against a heat-generating element. 
     
     
         10 . The heat-dissipating module according to  claim 1 , wherein the heat-absorbing portion is formed into a D shape or an arched shape.

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