Integrated Heat Conductive Light Emitting Diode (LED) White Light Source Module

Abstract

This invention discloses a new and advanced light emitting diodes (LEDs) light source module, and more specifically surface mounting LED dice and/or driver circuits on a slim linear Silicon wafer to provide superior heat dissipation capability through eutectic bonding onto a small Silicon base and the overall performance/cost ratio of the LED white light source module by an advanced integrated.

1 . A highly efficient heat-conductive Light Emitting Diode (LED) light source module comprising
 a predesigned printed circuit board or a patterned assembly;   a slim linear Silicon wafer base for direct surface contact between LED's and Silicon (Si) surface;   a plurality of LED dice bonded on a slim linear Silicon wafer base; and   a separate driver integrated circuit (IC),   wherein the said plurality of LED dice are mounted in the said slim linear Silicon base (with or without pre-designed IC's) and connected to the said predesigned printed circuit board to make it a light source module, and   wherein the said plurality of LED dice are either standing alone or configured within an electrically isolation cup with internal reflective surface.   
     
     
         2 . The highly efficient heat-conductive LED light source module according to  claim 1 , wherein the said plurality of LED dice are commercially available planar LEDs (with eutectic bondable reflective coating on substrate bottom side) or vertical LEDs, or
 the said plurality of LED dice are commercially available planar LEDs with a naked substrate bottom side;   then die bond these LED dice onto Si base (with corresponding eutectic bondable pre-designed patterns) and make eutectic joins to make thermal/electrical connections between LED dice and Si base;   
     
     
         3 . The highly efficient heat-conductive LED light source module according to  claim 2 , wherein the said light source module are concentrated within a small Si area on the said slim linear Silicon wafer (about a centimeter square) by applying tin based eutectic means between Au or Ag or Cu contacting areas (size of each area ranging from 0.01 to 1 milimeter square);
 after eutectic bonding, then wire-bonding the rest contacts in according to electrical circuitry design.   
     
     
         4 . The highly efficient heat-conductive LED light source module according to  claim 3 , further phosphor-coating the said light source module on its pre-designed light emitting side to get blue/white light conversion. 
     
     
         5 . The highly efficient heat-conductive LED light source module according to  claim 4 , wherein the said light source module may be configured (if so designed) within an electrically isolation cup with internal reflective surface (and Phosphor coated lens/diffuser parts may be mounted if so designed) and cure the filled material in the said cup;
 then the said module bottom of the said slim linear Silicon wafer base are further soldered to a pre-designed metal heat sink assembly.   
     
     
         6 . The highly efficient heat-conductive LED light source module according to  claim 5 , wherein the said plurality of LED dice are connected to a pre-designed power supply assembly including driver IC and other components. 
     
     
         7 . The highly efficient heat-conductive LED light source module according to  claim 6 , wherein the said module driver IC may also be connected to the said slim linear Silicon wafer base by
 a) embedding the said driver IC design by processing directly on the said same Si wafer base through foundry services, or   b) bonding the said driver IC on the said slim linear Si wafer base.