US2012049253A1PendingUtilityA1

Semiconductor device and method for fabricating the same

Assignee: BAE SANG-MANPriority: Dec 28, 2004Filed: Nov 8, 2011Published: Mar 1, 2012
Est. expiryDec 28, 2024(expired)· nominal 20-yr term from priority
H10D 30/603H10D 30/0221H10D 62/021H10D 84/0142H10D 84/0128H10D 84/0133H10D 62/292H10D 84/038
30
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Claims

Abstract

A semiconductor device and a method for fabricating the same are provided. The method includes: forming a plurality of protruded patterns smaller than gate structures by selectively removing predetermined portions of a substrate; and forming the gate structures over the protruded patterns. The semiconductor device includes: a plurality of protruded substrate portions smaller than the gate structures; and a plurality of gate structures encompassing the protruded substrate portions. Each of the gate structures includes a gate conductive layer that extends below the top and along profiles of the corresponding protruded portion such that channels are formed on surfaces of the protruded portions.

Claims

exact text as granted — not AI-modified
1 .- 7 . (canceled) 
     
     
         8 . A semiconductor device, comprising:
 a plurality of protruded substrate portions, each of the protruded portions protruding upwardly from the substrate and having a first side and a second side sloping downward from a top provided there between such that each protruded portion forms a cross-sectional shape of a trapezoid; and   a plurality of gate structures encompassing the protruded substrate portions, each of the gate structures including a gate conductive layer that is wider than the corresponding protruded portion, each gate conductive layer being formed over the first side, the top, and the second side of the corresponding protruded portion so as to extend below the top of the protruded portion and along profiles of the first side, the top, and the second side of the protruded portion such that channels are formed on surfaces of the protruded substrate portion.   
     
     
         9 . The semiconductor device of  claim 8 , wherein each of the gate structures includes gate insulation layers, and a gate metal layer, and wherein each gate conductive layer includes silicon. 
     
     
         10 . The semiconductor device of  claim 9 , wherein the protruded substrate portions are formed to have widths in a range of approximately one third to approximately two third of the widths of the gate structures.

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