US2012052246A1PendingUtilityA1

Mesoscale pyramids, arrays and methods of preparation

49
Assignee: ODOM TERI WPriority: Apr 26, 2005Filed: Oct 31, 2011Published: Mar 1, 2012
Est. expiryApr 26, 2025(expired)· nominal 20-yr term from priority
B22F 1/056B22F 1/0553B22F 1/054C23C 14/042C23C 14/0005B82Y 30/00B22F 9/12Y10T428/24612Y10T428/24479G02B 5/008
49
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

Ordered, two-dimensional arrays of pyramidal particulates and related methods of preparation.

Claims

exact text as granted — not AI-modified
We claim: 
     
         1 . A composite comprising a dielectric component and two-dimensional substantially planar array of metallic pyramidal components, said pyramidal components uniformly oriented within said dielectric component. 
     
     
         2 . The composite of  claim 1  wherein said pyramidal components comprise a noble metal. 
     
     
         3 . The composite of  claim 2  wherein said pyramidal components comprise a multi-layered composition. 
     
     
         4 . The composite of  claim 3  wherein each said layer comprises a thickness dimension less than about 65 nm. 
     
     
         5 . The composite of  claim 1  wherein said pyramidal components comprise a basal dimension up to about 300 nm and a tip radius of curvature ranging from less than about 2 nm to about 15 nm. 
     
     
         6 . The composite of  claim 4  wherein said pyramidal components comprise a basal dimension ranging from about 100 nm to about 250 nm, and a tip radius of curvature less than about 10 nm. 
     
     
         7 . The composite of  claim 6  wherein each said pyramidal component comprises a configuration of at least one layer, each said layer comprising a thickness dimension ranging between about 10 nm and about 50 nm. 
     
     
         8 . The composite of  claim 1  comprising up to about 10 8  pyramidal components per square inch of said dielectric component. 
     
     
         9 . The composite of  claim 8  wherein said dielectric component comprises a film comprising a thickness dimension up to about 15 microns. 
     
     
         10 . The composite of  claim 9  wherein said dielectric component comprises a poly(dimethylsiloxane).

Cited by (0)

No later patents cite this yet.

References (0)

No backward citations on record.