Ceramic substrate, method of manufacturing the same, and electrical device using the same

Abstract

Provided are a ceramic substrate, a method of manufacturing the same, and an electrical device using the same. A ceramic substrate includes a first laminated body, a second laminated body and an adhesive part. The first laminated body includes a predetermined electrode formed therein. The second laminated body is laminated on and electrically connected to the first laminated body. Also, the adhesive part is intervened between the first laminated body and the second laminated body to adhere the first and second laminated bodies through interfacial reaction.

1 - 11 . (canceled) 
     
     
         12 . A method of manufacturing a ceramic substrate, the method comprising:
 laminating an adhesive part on a first laminated body having a predetermined electrode therein;   laminating a second laminated body on the adhesive part; and   firing the first laminated body, the second laminated body, and the adhesive part.   
     
     
         13 . The method of  claim 12 , wherein the second laminated body comprises a high temperature co-fired ceramic substrate. 
     
     
         14 . The method of  claim 13 , wherein the first laminated body comprises an unfired ceramic laminated body, the first laminated body being adhered to the high temperature co-fired ceramic substrate by the adhesive part through the firing. 
     
     
         15 . The method of  claim 13 , wherein the first laminated body comprises an already-fired low temperature co-fired ceramic substrate, the first laminated body being adhered to the high temperature co-fired ceramic substrate by the adhesive part through the firing. 
     
     
         16 . The method of  claim 14 , wherein the firing comprises a low-temperature firing performed within a sintering temperature range of the low temperature co-fired ceramic substrate. 
     
     
         17 . The method of  claim 16 , wherein the adhesive part comprises a glass sintered through the low-temperature firing, the glass providing a predetermined adhesion through interfacial reaction with the high temperature co-fired ceramic substrate and the low temperature co-fired ceramic substrate, respectively. 
     
     
         18 . The method of any of  claims 13 , prior to the firing, further comprising forming a plurality of holes in the high temperature co-fired ceramic substrate and filling the plurality of holes with a predetermined electrode material. 
     
     
         19 . The method of  claim 18 , wherein the electrode material filled in the high temperature ceramic substrate is identical to an electrode material filled in the electrode of the first laminated body.