Enclosure of electronic device

Abstract

An enclosure of an electronic device includes a bottom wall and a sidewall. The sidewall includes at least two non-coplanar portions. Each of the non-coplanar portions defines a plurality of through holes for heat dissipation.

What is claimed is: 
     
         1 . An enclosure comprising:
 a bottom wall; and   a sidewall extending from the bottom wall and comprising at least two non-coplanar portions, wherein each of the at least two non-coplanar portions defines a plurality of through holes for heat dissipation.   
     
     
         2 . The enclosure of  claim 1 , wherein the at least two non-coplanar portions comprise a first portion substantially perpendicularly extending from the bottom wall, a second portion substantially parallel to the first portion, and a third portion connected between the first portion and the second portion. 
     
     
         3 . The enclosure of  claim 2 , wherein the third bend portion is substantially parallel to the bottom wall. 
     
     
         4 . The enclosure of  claim 1 , wherein the at least two non-coplanar portions comprise a first portion slantingly extending from the bottom wall, and a second portion extending from the first portion opposite and substantially perpendicular to the bottom wall.