Led package structure and packaging method thereof

Abstract

A LED package structure includes a supporting substrate, a first electrically-conductive structure, a LED chip, an insulating layer and a second electrically-conductive structure. The supporting substrate includes a top surface, a bottom surface and a first channel. The first electrically-conductive structure is filled in the first channel and partially formed on the top and bottom surfaces of the supporting substrate. The LED chip is disposed over the supporting substrate. The insulating layer is formed over the supporting substrate and on bilateral sides of the LED chip. The insulating layer has a second channel corresponding to the first electrically-conductive structure. The second electrically-conductive structure is filled in the second channel and partially formed on the insulating layer, and connected with an electrode of the LED chip. The LED chip and the top and bottom surfaces of the supporting substrate are connected with each other through the first and second electrically-conductive structures.

What is claimed is: 
     
         1 . A LED package structure, comprising:
 a supporting substrate comprising a top surface, a bottom surface and at least one first channel;   at least one first electrically-conductive structure filled in said first channel and partially formed on said top surface and said bottom surface of said supporting substrate;   a LED chip disposed over said supporting substrate;   an insulating layer formed over said supporting substrate and on bilateral sides of said LED chip, wherein said insulating layer has at least one second channel corresponding to said first electrically-conductive structure; and   at least one second electrically-conductive structure filled in said second channel and partially formed on said insulating layer, and connected with an electrode of said LED chip, wherein said LED chip and said top surface and said bottom surface of said supporting substrate are electrically connected with each other through said first electrically-conductive structure and said second electrically-conductive structure.   
     
     
         2 . The LED package structure according to  claim 1 , wherein said supporting substrate further comprises a concave structure, and said LED chip is accommodated within said concave structure. 
     
     
         3 . The LED package structure according to  claim 1 , wherein said insulating layer and said LED chip are substantially coplanar. 
     
     
         4 . The LED package structure according to  claim 1 , further comprising a light conversion layer formed on a top surface of said LED chip or on said top surface and sidewalls of said LED chip. 
     
     
         5 . The LED package structure according to  claim 1 , further comprising a light-transmissible member formed over said LED chip and said second electrically-conductive structure. 
     
     
         6 . The LED package structure according to  claim 5 , further comprising a light conversion layer formed on a surface of said light-transmissible member or in said light-transmissible member. 
     
     
         7 . The LED package structure according to  claim 5 , wherein said light-transmissible member comprises silicone, polymeric material, epoxy resin, silicon dioxide or glass. 
     
     
         8 . The LED package structure according to  claim 1 , wherein said supporting substrate is a silicon wafer, a ceramic substrate, a sapphire substrate, a metallic substrate, a glass substrate or a plastic substrate. 
     
     
         9 . The LED package structure according to  claim 1 , wherein said insulating layer comprises silicon dioxide, polymeric material, silicone, photoresist, benzocyclobutene or epoxy resin. 
     
     
         10 . A LED package structure, comprising:
 a supporting substrate having a top surface and a bottom surface, wherein said supporting substrate comprises a first channel and a concave structure;   at least one first electrically-conductive structure filled in said first channel and partially formed on said top surface and said bottom surface of said supporting substrate;   a LED chip accommodated within said concave structure;   an insulating layer formed over said supporting substrate and said LED chip and having at least two second channels, wherein said second channels are corresponding to an electrode of said LED chip and said first electrically-conductive structure, respectively; and   at least one second electrically-conductive structure filled in said second channels and partially formed on said insulating layer, and connected with said electrode of said LED chip and said first electrically-conductive structure, wherein said LED chip and said top surface and said bottom surface of said supporting substrate are electrically connected with each other through said first electrically-conductive structure and said second electrically-conductive structure.   
     
     
         11 . The LED package structure according to  claim 10 , wherein said insulating layer is a dry film, and said insulating layer is not formed within said concave structure and on a sidewall of said LED chip. 
     
     
         12 . The LED package structure according to  claim 10 , wherein said insulating layer is further formed within said concave structure. 
     
     
         13 . The LED package structure according to  claim 10 , wherein said first channel is further used as a dicing line. 
     
     
         14 . A LED packaging method, comprising steps of:
 providing a supporting substrate comprising a top surface and a bottom surface;   forming at least one first channel in said supporting substrate;   forming at least one first electrically-conductive structure in said first channel and partially on said top surface and said bottom surface of said supporting substrate so as to electrically connect said top surface and said bottom surface of said supporting substrate;   disposing a LED chip over said supporting substrate;   forming an insulating layer over said supporting substrate and on bilateral sides of said LED chip, wherein said insulating layer has at least one second channel corresponding to said first electrically-conductive structure; and   forming at least one second electrically-conductive structure in said second channel and partially on said insulating layer so as to connect with an electrode of said LED chip, wherein said LED chip and said top surface of said supporting substrate are electrically connected with each other through said second electrically-conductive structure.   
     
     
         15 . The LED package method according to  claim 14 , further comprising a step of forming a concave structure in said supporting substrate, wherein said LED chip is accommodated within said concave structure. 
     
     
         16 . The LED package method according to  claim 14 , wherein said insulating layer and said LED chip are substantially coplanar. 
     
     
         17 . The LED package method according to  claim 14 , wherein said insulating layer is a planarization structure formed by capillary injection, vacuum suction or stencil printing. 
     
     
         18 . The LED package method according to  claim 14 , wherein said LED chip is die-bonded on said supporting substrate by eutectic bonding process, silver paste, solder paste, polymeric material or silicone. 
     
     
         19 . The LED package method according to  claim 14 , further comprising a step of forming a light-transmissible member over said LED chip and said second electrically-conductive structure. 
     
     
         20 . The LED package method according to  claim 19 , further comprising a step of forming a light conversion layer on a surface of said light-transmissible member or in said light-transmissible member. 
     
     
         21 . The LED package method according to  claim 14 , further comprising a step of forming a light conversion layer on a top surface of said LED chip or on said top surface and sidewalls of said LED chip. 
     
     
         22 . A LED packaging method, comprising steps of:
 providing a supporting substrate comprising a top surface and a bottom surface;   forming at least one first channel and a concave structure in said supporting substrate;   forming at least one first electrically-conductive structure in said first channel and partially on said top surface and said bottom surface of said supporting substrate so as to electrically connect said top surface and said bottom surface of said supporting substrate;   disposing a LED chip within said concave structure of said supporting substrate;   forming an insulating layer over said supporting substrate and said LED chip and forming at least two second channels in said insulating layer, wherein each said second channel is corresponding to an electrode of said LED chip and said first electrically-conductive structure; and   forming at least one second electrically-conductive structure in said second channels and partially on said insulating layer so as to connect with said electrode of said LED chip and said first electrically-conductive structure.   
     
     
         23 . The LED package method according to  claim 22 , wherein said first electrically-conductive structure is a film layer formed on the surface of said first channel. 
     
     
         24 . The LED package method according to  claim 22 , wherein said insulating layer is a dry film, and said insulating layer is not formed within said concave structure and on a sidewall of said LED chip. 
     
     
         25 . The LED package method according to  claim 22 , wherein said insulating layer is further formed within said concave structure. 
     
     
         26 . The LED package method according to  claim 22 , further comprising a step of removing said insulating layer.