Distributed cooling of arrayed semi-conductor radiation emitting devices

Abstract

Techniques for the removal of waste heat from solid state, semiconductor devices (such as cooking or heating devices) are provided. In particular, techniques for conducting waste heat away from the device through a heat sink in contact with a cooling system are provided. In addition, a multi-head cooling system applicable to multiple solid state, semiconductor sources is provided.

1 . A system for providing cooling to an array of semi-conductor based radiation emitting devices, the system comprising:
 a mounting substrate to which the array of radiation emitting devices is mounted on a first surface thereof, the mounting substrate including at least one of a first material having high thermal conductivity and a second material having electrical insulating features;   a heat exchange body connected to a second surface of the mounting substrate;   heat exchange fluid cavity within the heat exchange body operative to maintain a flow of heat exchange fluid in the heat exchange body; and,   fluid connections provided to an inlet and an outlet of the heat exchange fluid cavity.   
     
     
         2 . The system as set forth in  claim 1  further comprising a cooling system connected to the fluid connections. 
     
     
         3 . The system as set forth in  claim 2  wherein the cooling system is at least one of a vapor phase cooling system, water-based cooling system, air based cooling system or refrigerant-based cooling system. 
     
     
         4 . The system as set forth in  claim 1  wherein the semi-conductor based radiation emitting devices emit energy in narrow band in one of the infrared, ultraviolet and visible ranges. 
     
     
         5 . The system as set forth in  claim 3  wherein the narrow band is less than 300 nm, full width half max. 
     
     
         6 . The system as set forth in  claim 1  wherein the semi-conductor based radiation emitting devices emit energy in the microwave range. 
     
     
         7 . The system as set forth in  claim 1  wherein the mounting substrate is formed of or contains at least one of copper material, diamond material, nano-conductor composite material or alloys thereof. 
     
     
         8 . The system as set forth in  claim 1  wherein the mounting substrate and the heat exchange body are integral. 
     
     
         9 . The system as set forth in  claim 1  further comprising a controller operative to control a flow of fluid to the heat exchange fluid cavity. 
     
     
         10 . The system as set forth in  claim 1  further comprising at least one of a fluid regulator and a temperature sensor. 
     
     
         11 . The system as set forth in  claim 1  wherein the array is two-dimensional. 
     
     
         12 . The system as set forth in  claim 1  wherein the array is an X-by-Y array wherein both X and Y are greater than 1. 
     
     
         13 . A system for providing cooling to multiple arrays of semi-conductor based radiation emitting devices, the system comprising:
 a first array cooling subassembly including a first mounting substrate to which a first array of radiation emitting devices is mounted on a first surface thereof, the mounting substrate including at least one of a first material having high thermal conductivity and a second material having electrical insulating features, a first heat exchange body connected to a second surface of the mounting substrate, a first heat exchange fluid cavity within the first heat exchange body operative to maintain a flow of heat exchange fluid in the first heat exchange body, and first fluid connections provided to an inlet and an outlet of the first heat exchange fluid cavity; and,   a second array cooling subassembly including a second mounting substrate to which a second array of radiation emitting devices is mounted on a first surface thereof, a second heat exchange body connected to a second surface of the mounting substrate, a second heat exchange fluid cavity within the second heat exchange body operative to maintain a flow of heat exchange fluid in the second heat exchange body, and second fluid connections provided to an inlet and an outlet of the second heat exchange fluid cavity.   
     
     
         14 . The system as set forth in  claim 13  further comprising a cooling system connected to the first array cooling subassembly and the second array cooling subassembly. 
     
     
         15 . The system as set forth in  claim 14  wherein the first array cooling subassembly and the second array cooling subassembly are connected in parallel to the cooling system. 
     
     
         16 . The system as set forth in  claim 14  wherein the first array cooling subassembly and the second array cooling subassembly are connected in series with the cooling system. 
     
     
         17 . The system as set forth in  claim 13  wherein the first array cooling subassembly and the second array cooling subassembly are arranged relative to a work area to perform heating and cooking functions. 
     
     
         18 . The system as set forth in  claim 17  wherein the work area is an oven cavity. 
     
     
         19 . The system as set forth in  claim 17  wherein the work area is a heating zone. 
     
     
         20 . The system as set forth in  claim 13  wherein radiation emitting devices of the first array cooling subassembly and the second array cooling subassembly are of the same type. 
     
     
         21 . The system as set forth in  claim 13  wherein radiation emitting devices of the first array cooling subassembly and the second array cooling subassembly are of different types. 
     
     
         22 . The system as set forth in  claim 21  wherein the first array cooling subassembly is connected to a first cooling system and the second array cooling subassembly is connected to a second cooling system. 
     
     
         23 . The system as set forth in  claim 13  further comprising a controller operative to control a flow of fluid to the first array cooling subassembly and the second array cooling subassembly. 
     
     
         24 . The system as set forth in  claim 13  further comprising at least one of a fluid regulator and a temperature sensor. 
     
     
         25 . A method for providing cooling to an array of semi-conductor based radiation emitting devices disposed on an array cooling subassembly including a mounting substrate to which the array of radiation emitting devices is mounted on a first surface thereof, the mounting substrate including at least one of a first material having high thermal conductivity and a second material having electrical insulating features, a heat exchange body connected to a second surface of the mounting substrate, a heat exchange fluid cavity within the heat exchange body operative to maintain a flow of heat exchange fluid in the heat exchange body, fluid connections provided to an inlet and an outlet of the heat exchange fluid cavity, the method comprising:
 receiving data at a controller;   determining fluid flow parameters for the flow of heat exchange fluid in the heat exchange cavity based on the data; and,   controlling the flow to the inlet of the heat exchange cavity based on the determined fluid flow parameters.