Blister Package

Abstract

A blister package is provided for retaining individual product units. The blister package is formed by a receptacle substrate and an outer laminate. The receptacle substrate includes a sealing flange and one or more receptacle hollows for retaining product therein. The outer laminate includes a first layer covering a sealing layer, with the sealing layer bonded to the receptacle flange and covering the product within the hollows. A repeating score line pattern is formed in the outer laminate for promoting a tear in the laminate upon forcing the product from the receptacle hollow against the outer laminate. The score pattern extends substantially across the area of the outer laminate covering the receptacle hollow and includes a plurality of spaced score lines formed in a crosswise relationship.

What is claimed is: 
     
         1 . A blister package for retaining individual products, the package comprising:
 a receptacle substrate, the receptacle substrate having a planer sealing flange and at least one retaining receptacle hollow formed to retain product therein, and   an outer laminate comprising
 a first layer having a score pattern thereon for promoting propagation of a tear in the outer laminate upon forcing the product from the receptacle hollow against the outer laminate, and 
 a sealing layer positioned between the first layer and the receptacle substrate, the sealing layer bonded on one side to the receptacle substrate flange and covering the receptacle hollow, and the sealing layer bonded to the first layer on the opposite side of the sealing layer from the flange substrate and receptacle hollow, 
   wherein the score pattern extends across the portion of the outer laminate covering the receptacle hollow of the receptacle substrate, the score pattern having two repeating line patterns positioned in a crosswise direction to one another, and   wherein at least one of the line patterns is defined by a plurality of rows of curved score lines.   
     
     
         2 . A blister package as in  claim 1  wherein the curved score lines include a pattern of pair-sets of curved lines. 
     
     
         3 . A blister package as in  claim 2  wherein the pair-sets of curved score lines comprise opposing curves. 
     
     
         4 . A blister package as in  claim 1  wherein both repeating line patterns are defined by rows of curved score lines. 
     
     
         5 . A blister package as in  claim 1  wherein the curved score lines are “S” shaped. 
     
     
         6 . A blister package as in  claim 5  wherein both repeating line patterns are defined by rows of curved “S” shaped score lines. 
     
     
         7 . A blister package as in  claim 6  wherein the ends of the curved score lines are positioned adjacent and in an overlapping relationship with one another. 
     
     
         8 . A blister package as in  claim 1  wherein the two line patterns form a series of aligned rows. 
     
     
         9 . A blister package as in  claim 8  wherein the score lines within each of the aligned rows are oriented in alternating crosswise angle with respect to the direction of the score lines in each of the adjacent rows. 
     
     
         10 . A blister package as in  claim 1  wherein the score pattern is formed only in the first layer of the outer laminate. 
     
     
         11 . A blister package as in  claim 1  wherein the outer laminate is formed from polymer materials. 
     
     
         12 . A blister package as in  claim 1  wherein the sealing layer is heat sealed to the sealing flange of the receptacle substrate. 
     
     
         13 . A blister package for retaining product therein, the package comprising:
 a receptacle substrate, the receptacle substrate having a sealing flange and at least one retaining receptacle hollow formed therein, the hollow formed for retaining one or more products therein,   an outer layer, the outer layer formed from polymer film and bonded to the sealing flange and covering the receptacle hollow, and   a score line pattern composed of a plurality of score lines, the score line pattern formed in the outer layer and extending across the area of the outer layer covering the receptacle hollow, the score lines within the score pattern extending into the outer layer at a defined depth, and   the score line pattern defined by a first plurality of spaced score lines, wherein the first plurality of score lines are curved, and a second plurality of score lines, wherein the second plurality of score lines are positioned crosswise with respect to the direction of orientation of first plurality of score lines.   
     
     
         14 . A blister package as in  claim 13  wherein the depth of the score lines is less than the thickness of the outer layer. 
     
     
         15 . A blister package as in  claim 13  wherein the score lines within the second plurality of lines are curved. 
     
     
         16 . A blister package as in  claim 14  wherein the first and second plurality of curved score lines have an overlapping relationship, with an end of each line within the first plurality of score lines positioned transverse to a body portion of an adjacent line within the second plurality of score lines. 
     
     
         17 . A blister package as in  claim 13  wherein the material layers of the outer layer comprises a first layer having the score line pattern therein and a second layer for forming a seal between first layer and the sealing flange of the receptacle substrate. 
     
     
         18 . A blister package as in  claim 17  wherein the second layer is heat sealed to the flange of the receptacle substrate. 
     
     
         19 . A blister package for retaining product therein, the package comprising:
 a receptacle substrate, the receptacle substrate having a planer sealing flange and at least one retaining receptacle hollow formed to retain product, and   a top layer covering the receptacle hollow in the receptacle substrate, at least a portion of the top layer overlapping with and sealed to the planer sealing flange, and   a repeating pattern of spaced score lines formed in the top layer for promoting upon application of a force thereto the propagation of a tear in the top layer, the score pattern extending across the portion of the top layer covering the at least one retaining receptacle hollow,   the repeating score pattern defined by a plurality of rows of aligned curved score lines, the score lines within each of the plurality of rows positioned at transverse angle with respect one or more further rows of score lines.   
     
     
         20 . A blister package as in  claim 19  wherein the top layer further comprising a sealing layer, the sealing layer being heat sealed to the sealing flange of the receptacle substrate.