Semiconductor die package including multiple dies and a common node structure

Abstract

A semiconductor die package capable of being mounted to a motherboard is disclosed. The semiconductor die package includes a substrate, and a first semiconductor die mounted on the substrate, where the first semiconductor die includes a first vertical device comprising a first input region and a first output region at opposite surfaces of the first semiconductor die. The semiconductor die package includes a second semiconductor die mounted on the substrate, where second semiconductor die comprises a second vertical device comprising a second input region and a second output region at opposite surfaces of the second semiconductor die. A substantially planar conductive node clip electrically communicates the first output region in the first semiconductor die and the second input region in the second semiconductor die. The first semiconductor die and the second semiconductor die are between the substrate and the conductive node clip.

1 - 11 . (canceled) 
     
     
         12 . A method for making a semiconductor die package capable of being mounted to a motherboard, the method comprising:
 mounting a first semiconductor die to a substrate, wherein the first semiconductor die comprises a first vertical device comprising a first input region and a first output region at opposite surfaces of the first semiconductor die;   mounting a second semiconductor die to the substrate, wherein second semiconductor die comprises a second vertical device comprising a second input region and a second output region at opposite surfaces of the second semiconductor die; and   attaching a conductive node clip to the first semiconductor die and the second semiconductor die, wherein the conductive node clip electrically communicates the first output region in the first semiconductor die to the second input region in the second semiconductor die.   
     
     
         13 . The method of  claim 12  further comprising molding a molding material around the first and second semiconductor dies. 
     
     
         14 . The method of  claim 12  wherein the first semiconductor die, the second semiconductor die, and the conductive node clip form part of a synchronous buck converter circuit. 
     
     
         15 . The method of  claim 12  wherein the substrate is a leadframe structure. 
     
     
         16 . The method of  claim 12  further comprising molding a molding material around the first and second semiconductor dies, wherein the molding material has an exterior surface that is substantially coplanar with a surface of the conductive node clip. 
     
     
         17 . The method of  claim 12  wherein the first semiconductor die comprises a low side MOSFET and the second semiconductor die comprises a high side MOSFET, and wherein the first and second input regions are source regions and the first and second output regions are drain regions. 
     
     
         18 . The method of  claim 12  wherein the first semiconductor die is part of a first sub-package when the first semiconductor die is mounted to the substrate and the second semiconductor die is part of a second sub-package when the second semiconductor die is mounted to the substrate. 
     
     
         19 . The method of  claim 12  wherein the conductive node clip comprises copper. 
     
     
         20 . The method of  claim 12  further comprising mounting a controller die to the substrate. 
     
     
         21 . A method for making a semiconductor die package capable of being mounted to a motherboard, the method comprising:
 obtaining a first semiconductor die, wherein the first semiconductor die comprises a first vertical device comprising a first input region and a first output region at opposite surfaces of the first semiconductor die;   obtaining a second semiconductor, wherein second semiconductor die comprises a second vertical device comprising a second input region and a second output region at opposite surfaces of the second semiconductor die;   attaching a conductive node clip to the first semiconductor die and the second semiconductor die, wherein the conductive node clip electrically communicates the first output region in the first semiconductor die to the second input region in the second semiconductor die;   attaching the first semiconductor die, the second semiconductor die, and the conductive node clip to a substrate; and   performing a molding process, thereby forming a package.   
     
     
         22 . The method of  claim 21  wherein the first and second semiconductor dies are present in separate sub-packages prior to being attached to the conductive node clip. 
     
     
         23 - 34 . (canceled)