Cooling for superconducting machines

Abstract

A device for cooling superconducting machines has a closed thermal siphon system which can be filled with a liquid coolant and has an evaporator for evaporating the liquid coolant. In order to improve the cooling performance of the device, the surface area of the evaporator which can be wetted with the liquid coolant is increased.

1 - 8 . (canceled) 
     
     
         9 . A device for cooling a superconducting machine, comprising:
 a closed thermal siphon system to receive a liquid coolant; and   an evaporator to evaporate the liquid coolant, the evaporator having a displacer to displace the liquid coolant and thereby increase a surface area of the evaporator which can be wetted per volume of liquid coolant.   
     
     
         10 . The device as claimed in  claim 9 , wherein the evaporator is located in an interior of a rotor of the superconducting machine. 
     
     
         11 . The device as claimed in  claim 9 , wherein the evaporator and the displacer are cylindrical, having a circular cross section. 
     
     
         12 . The device as claimed in  claim 9 , wherein
 the evaporator has an irregular surface structure to thereby increase the surface area of the evaporator which can be effectively used for transfer of heat to the liquid coolant.   
     
     
         13 . The device as claimed in  claim 9 , wherein the irregular surface structure is one-dimensional. 
     
     
         14 . The device as claimed in  claim 9 , wherein the irregular surface structure is formed from groove- or fin-like elements. 
     
     
         15 . The device as claimed in  claim 9 , wherein the irregular surface structure is two-dimensional. 
     
     
         16 . The device as claimed in  claim 9 , wherein the irregular surface structure is formed of hole-like or spiky elements. 
     
     
         17 . The device as claimed in  claim 9 , wherein the liquid coolant is neon. 
     
     
         18 . The device as claimed in  claim 10 , wherein the evaporator and the displacer are cylindrical, having a circular cross section. 
     
     
         19 . The device as claimed in  claim 18 , wherein
 the evaporator has an irregular surface structure to thereby increase the surface area of the evaporator which can be effectively used for transfer of heat to the liquid coolant.   
     
     
         20 . The device as claimed in  claim 19 , wherein the irregular surface structure is formed from groove- or fin-like elements. 
     
     
         21 . The device as claimed in  claim 20 , wherein the irregular surface structure also includes hole-like or spiky elements. 
     
     
         22 . The device as claimed in  claim 21 , wherein the liquid coolant is neon.