US2012073980A1PendingUtilityA1

Iridium plating solution and method of plating using the same

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Assignee: ITO MASAHIROPriority: Sep 29, 2010Filed: Sep 29, 2010Published: Mar 29, 2012
Est. expirySep 29, 2030(~4.2 yrs left)· nominal 20-yr term from priority
Inventors:Masahiro Ito
C25D 3/567C25D 3/52
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Claims

Abstract

Proposed are an iridium plating solution capable of easily forming an iridium plating coat in which the occurrence of cracks is suppressed as much as possible and an iridium plating method. In the present invention, the iridium plating solution uses an iridium compound obtained by adding, to an iridium (III) complex salt containing a halogen as an anionic component, one or more compounds selected from the following group and by stirring the resulting mixture, the group consisting of a saturated monocarboxylic acid, a saturated monocarboxylic acid salt, a saturated dicarboxylic acid, a saturated dicarboxylic acid salt, a saturated hydroxycarboxylic acid, a saturated hydroxycarboxylic acid salt, an amide and urea, wherein the iridium plating solution includes at least one or more of Fe, Co, Ni and Cu.

Claims

exact text as granted — not AI-modified
1 . An iridium plating solution using an iridium compound obtained by adding, to an iridium (III) complex salt containing a halogen as an anionic component, one or more compounds selected from a following group and by stirring a resulting mixture, the group consisting of a saturated monocarboxylic acid, a saturated monocarboxylic acid salt, a saturated dicarboxylic acid, a saturated dicarboxylic acid salt, a saturated hydroxycarboxylic acid, a saturated hydroxycarboxylic acid salt, an amide and urea, wherein the iridium plating solution comprises at least one or more of Fe, Co, Ni and Cu. 
     
     
         2 . The iridium plating solution according to  claim 1 , wherein the content of at least one or more of Fe, Co, Ni and Cu is 0.01 g/L to 10 g/L. 
     
     
         3 . An iridium plating method wherein the plating solution according to  claim 1  is used, and plating is performed under the conditions that the pH is 1 to 8, the temperature is 50 to 98° C. and the current density is 0.01 to 3.0 A/dm 2 . 
     
     
         4 . An iridium plating method wherein the plating solution according to  claim 2  is used, and plating is performed under the conditions that the pH is 1 to 8, the temperature is 50 to 98° C. and the current density is 0.01 to 3.0 A/dm 2 .

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