Semiconductor device and electronic component module using the same

Abstract

A semiconductor device includes a circuit board having an element mounting area, connecting pads positioned in the same surface side as the element mounting area and external connectors to be connected with the connecting pads, respectively; and a semiconductor element mounted on the element mounting area of the circuit board and having electrode pads to be electrically connected with the connecting pads, respectively. The external connectors are detachably configured through a combination of convex portions and concave portions which are mechanically and electrically connected with one another.

1 . An electronic component module, comprising:
 a first module component with at least one semiconductor device having a circuit board having an element mounting area, connecting pads positioned in the same surface side as said element mounting area and external connectors to be connected with the said connecting pads, respectively;   a semiconductor element mounted on said element mounting area of said circuit board and having electrode pads to be electrically connected with said connecting pads, respectively, wherein said external connectors are detachably configured through a combination of convex portions and concave portions which are mechanically and electrically connected with one another; and   a second module component having connectors connectable for said external connectors of said first module component through said combination of convex portions and concave portions and at least one second electronic component of a semiconductor element and another electronic component except said semiconductor element.   
     
     
         2 . The electronic component module as set forth in  claim 1 , wherein in said first module component, said semiconductor element comprises a plurality of semiconductor elements which are stacked. 
     
     
         3 . The electronic component module as set forth in  claim 1 , wherein in said first module component, said semiconductor element comprises a plurality of semiconductor elements which are arranged in a plane. 
     
     
         4 . The electronic component module as set forth in  claim 1 , wherein in said first module component, each of said external connectors includes at least one of a convex connector corresponding to said convex portion and a concave connector corresponding to said concave portion, and is embedded into said circuit board. 
     
     
         5 . The electronic component module as set forth in  claim 4 , wherein an outer size of said convex connector is set larger than an inner size of said concave connector so that said convex connector can be electrically and mechanically connected with said concave connector by means of elastic deformation of said convex connector and said concave connector. 
     
     
         6 . The electronic component module as set forth in  claim 4 , wherein a thermal expansion coefficient of said concave connector is set larger than a thermal expansion coefficient of said convex connector so that said convex connector can be electrically and mechanically connected with said concave connector by means of the difference in thermal expansion between said convex connector and said concave connector. 
     
     
         7 . The electronic component module as set forth in  claim 6 , wherein when said thermal expansion coefficient of said convex connector is defined as α1 and said thermal expansion coefficient of said concave is defined as α2, a relation of α2>α1 is satisfied. 
     
     
         8 . The electronic component module as set forth in  claim 1 , wherein in said first module component, said semiconductor device comprises a plurality of semiconductor devices which are stacked through said combination of convex portions and concave portions which are mechanically and electrically connected with one another. 
     
     
         9 . The electronic component module as set forth in  claim 1 , wherein said first module component and said second module component are stacked upon one another through said combination of convex portions and concave portions which are mechanically and electrically connected with one another. 
     
     
         10 . The electronic component module as set forth in  claim 1 , wherein said first module component and said second module component are arranged in a plane with one another through said combination of convex portions and concave portions which are mechanically and electrically connected with one another. 
     
     
         11 . The electronic component module as set forth in  claim 10 , wherein said first module component is connected with said second module component via a connecting board through said combination of convex portions and concave portions which are mechanically and electrically connected with one another. 
     
     
         12 . An element built-in board, comprising:
 an electronic component module as set forth in  claim 10  which is embedded in an insulating resin layer; and   a pair of insulating resin sheets to sandwich said electronic component module.   
     
     
         13 . An element built-in board, comprising:
 an electronic component module as set forth in  claim 11  which is embedded in an insulating resin layer; and   a pair of insulating resin sheets to sandwich said electronic component module.