Liquid ejecting head and liquid ejecting apparatus

Abstract

A liquid ejecting head which includes a flow passage forming substrate that has pressure generating chambers which communicate with nozzles capable of ejecting a liquid, pressure generating elements which apply pressure to the pressure generating chambers in order to eject the liquid from the nozzles, lead electrodes that supply electric signals to the pressure generating elements, wiring substrates that supply the electric signals to the lead electrodes, and a supporting member that supports the wiring substrates so as to raise the wiring substrates from a surface of the liquid ejecting head having the lead electrodes provided thereon.

1 . A liquid ejecting head comprising:
 a flow passage forming substrate including pressure generating chambers which are capable of communicating with nozzles for ejecting a liquid provided therein;   pressure generating elements capable of applying pressure to eject the liquid in the pressure generating chambers;   lead electrodes capable of supplying electric signal to the pressure generating element;   wiring substrate capable of supplying the electric signal to the lead electrode; and   a supporting member that supports the wiring substrate so as to raise the wiring substrate from a surface of the liquid ejecting head having the lead electrodes provided thereon,   wherein a surface of the wiring substrate and the surface of the liquid ejecting head meet at an angle.   
     
     
         2 . The liquid ejecting head according to  claim 1 , wherein the wiring substrate is formed perpendicular to the surface of the liquid ejecting head. 
     
     
         3 . A liquid ejecting apparatus comprising the liquid ejecting head according to  claim 1 .