US2012088105A1PendingUtilityA1

Resin pellet and method for producing the same

Assignee: CHIBA KAZUYUKIPriority: Jun 19, 2009Filed: Jun 14, 2010Published: Apr 12, 2012
Est. expiryJun 19, 2029(~2.9 yrs left)· nominal 20-yr term from priority
C08L 23/08B29B 9/00C08J 3/12C08L 31/04B29B 9/12C08J 2323/08C08J 3/124Y10T428/2991B29B 2009/165
37
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Claims

Abstract

A resin pellet of the present invention includes a resin base material and a plurality of microparticles embedded in the resin base material. The resin pellet is covered with the plurality of microparticles on the surface of the resin base material. According to the present invention, it is possible to prevent detachment of the microparticles to be applied on the resin base material and to effectively suppress blocking of resin pellets.

Claims

exact text as granted — not AI-modified
1 . A resin pellet comprising a resin base material and a plurality of microparticles embedded in said resin base material, wherein the surface of said resin base material is covered with said plurality of microparticles. 
     
     
         2 . The resin pellet according to  claim 1 , wherein said microparticles are embedded in said resin base material by dispersing said microparticles and said resin base material in a softened state in a liquid. 
     
     
         3 . The resin pellet according to  claim 1 , wherein said microparticles contain a resin component. 
     
     
         4 . The resin pellet according to  claim 1 , wherein said resin base material and said microparticles contain the same resin component. 
     
     
         5 . The resin pellet according to  claim 1 , wherein said resin base material contains an ethylene-vinyl acetate copolymer. 
     
     
         6 . The resin pellet according to  claim 5 , wherein the content of vinyl acetate in said ethylene-vinyl acetate copolymer contained in said resin base material is 25 to 50 mass %. 
     
     
         7 . The resin pellet according to  claim 1 , wherein said microparticles contain an ethylene-vinyl acetate copolymer. 
     
     
         8 . The resin pellet according to  claim 7 , wherein the content of vinyl acetate in said ethylene-vinyl acetate copolymer contained in said microparticles is 5 to 20 mass %. 
     
     
         9 . The resin pellet according to  claim 1 , wherein both said resin base material and said microparticles comprise an ethylene-vinyl acetate copolymer. 
     
     
         10 . The resin pellet according to  claim 1 , wherein the average particle size of said microparticles is equal to or less than 20 μm. 
     
     
         11 . The resin pellet according to  claim 1 , wherein the shore hardness of said microparticles is higher than the shore hardness of said resin base material. 
     
     
         12 . The resin pellet according to  claim 1 , wherein the degree of crystallinity of said microparticles by the X-rays is higher than the degree of crystallinity of said resin base material by the X-rays. 
     
     
         13 . The resin pellet according to  claim 1 , wherein the Vicat softening point of said microparticles is higher than the Vicat softening point of said resin base material. 
     
     
         14 . The resin pellet according to  claim 1  wherein said resin base material is a particle. 
     
     
         15 . A method for producing a resin pellet comprising
 preparing a resin base material and   embedding a plurality of microparticles in said resin base material,   wherein, in embedding a plurality of microparticles in said resin base material, the surface of said resin base material is covered with said plurality of microparticles.   
     
     
         16 . The method for producing a resin pellet according to  claim 15 ,
 wherein, in embedding a plurality of microparticles in said resin base material, said microparticles are embedded in said resin base material by dispersing said microparticles and said resin base material in a softened state in a liquid.   
     
     
         17 . The method for producing a resin pellet according to  claim 15 ,
 wherein, in embedding a plurality of microparticles in said resin base material, said resin base material is come into contact with said microparticles at a temperature of equal to or more than 35 degrees centigrade and equal to or less than 80 degrees centigrade.

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