Tile systems with enhanced thermal properties and methods of making and using same

Abstract

The various embodiments of the present invention are directed to tile systems and to methods of making and using the tile systems. The tile systems provide improved thermal properties to floor and wall coverings in either heated or unheated applications. The tile systems generally include a tile and a discrete phase change material.

1 . A tile system, comprising:
 a tile; and   a phase change material in thermal communication with the tile, wherein the phase change material does not comprise a portion of the tile, and wherein the phase change material is configured to increase the heat capacity of the tile system.   
     
     
         2 . The tile system of  claim 1 , further comprising a heating element in thermal communication with the phase change material. 
     
     
         3 . The tile system of  claim 1 , further comprising a thermally insulating layer disposed between the tile and a surface of a floor or wall on which the tile system is disposed. 
     
     
         4 . The tile system of  claim 1 , wherein the tile is a ceramic tile. 
     
     
         5 . The tile system of  claim 1 , wherein the phase change material is a solid state phase change material. 
     
     
         6 . The tile system of  claim 1 , wherein the phase change material is a liquid phase change material encapsulated in a thermally conductive container. 
     
     
         7 . The tile system of  claim 1 , wherein the phase change material is disposed in a cavity within a backside surface of the tile. 
     
     
         8 . The tile system of  claim 1 , wherein the phase change material is disposed directly on a backside surface of the tile. 
     
     
         9 . The tile system of  claim 1 , wherein the tile comprises a portion of a floating floor or wall tile unit. 
     
     
         10 . The tile system of  claim 9 , wherein the floating floor or wall tile unit further comprises a substrate, wherein the tile is disposed on, or within a cavity within, the substrate. 
     
     
         11 . The tile system of  claim 10 , wherein the phase change material is interposed between a backside surface of the tile and a top surface of the substrate. 
     
     
         12 . The tile system of  claim 10 , wherein the phase change material is disposed at least partially within a cavity within a top surface of the substrate. 
     
     
         13 . The tile system of  claim 10 , wherein the phase change material comprises a portion of the substrate and is entirely encapsulated by the substrate. 
     
     
         14 . The tile system of  claim 10 , wherein the phase change material is disposed on, or within a cavity within, a backside surface of the substrate. 
     
     
         15 . A tile system, comprising:
 a tile unit, comprising a substrate and a tile that is disposed on, or within a cavity within, the substrate; and   a phase change material in thermal communication with the tile;   wherein the phase change material does not comprise a portion of the tile;   wherein the phase change material is configured to increase the heat capacity of the tile system; and   wherein the phase change material is disposed in a cavity within a backside surface of the tile, directly on the backside surface of the tile, between the backside surface of the tile and a top surface of the substrate, at least partially within a cavity within the top surface of the substrate, entirely within the substrate, on a backside surface of the substrate, within a cavity within the backside surface of the substrate, or a combination comprising at least one of the foregoing.   
     
     
         16 . The tile system of  claim 15 , further comprising a heating element in thermal communication with the phase change material. 
     
     
         17 . The tile system of  claim 15 , further comprising a thermally insulating layer disposed between the tile unit and a surface of a floor or wall on which the tile unit is disposed. 
     
     
         18 . The tile system of  claim 15 , wherein the phase change material is a solid state phase change material. 
     
     
         19 . The tile system of  claim 15 , wherein the phase change material is a liquid phase change material encapsulated in a thermally conductive container. 
     
     
         20 . The tile system of  claim 15 , wherein the substrate comprises a thermally conductive element in thermal communication with the phase change material and the tile, wherein the thermally conductive element facilitates heat transfer between the phase change material and the tile.