Composite alloy bonding wire and manufacturing method thereof

Abstract

A manufacturing method for a composite alloy bonding wire and products thereof. A primary material of Ag is melted in a vacuum melting furnace, and then a secondary metal material of Pd is added into the vacuum melting furnace and is co-melted with the primary material to obtain an Ag—Pd alloy solution. The obtained Ag—Pd alloy solution is drawn to obtain an Ag—Pd alloy wire. The Ag—Pd alloy wire is then drawn to obtain an Ag—Pd alloy bonding wire with a predetermined diameter.

1 . A manufacturing method for a composite alloy bonding wire, comprising:
 a) providing a primary material of Ag;   b) melting the primary material in a vacuum melting furnace, adding a secondary metal material of Pd into the vacuum melting furnace and co-melting with the primary material in the vacuum melting furnace to obtain an Ag—Pd alloy that excludes Mg and Al;   c) casting and drawing the Ag—Pd alloy to obtain an Ag—Pd alloy wire; and   d) drawing the Ag—Pd alloy wire to obtain an Ag—Pd alloy bonding wire with a predetermined diameter used for packaging processes for IC, LED or SAW.   
     
     
         2 . The manufacturing method according to  claim 1 , wherein the weight percent of Ag in step a) is 90.00%˜99.99%. 
     
     
         3 . The manufacturing method according to  claim 2 , wherein the weight percent of Pd in step b) is not more than 10.00 wt. %. 
     
     
         4 . The manufacturing method according to  claim 1 , wherein the surface of the Ag—Pd alloy bonding wire is cleaned and is annealed after step d). 
     
     
         5 . A alloy bonding wire, comprising:
 90.00˜99.99 wt. % Ag; and   0.01˜10.00 wt. % but not more than 10.00 wt. % Pd, wherein the Ag and Pd are melted to obtain an Au—Ag—Pd alloy that excludes Mg and Al, and Ag and Pd are essentially uniformly distributed in the alloy bonding wire, continuous casting and drawing processes are performed on the Ag—Pd alloy to obtain the alloy bonding wire used for packaging processes for IC, LED or SAW.