US2012094416A1PendingUtilityA1

Low-cost large-screen wide-angle fast-response liquid crystal display apparatus

56
Assignee: TANAKA SAKAEPriority: Jun 15, 2006Filed: Dec 22, 2011Published: Apr 19, 2012
Est. expiryJun 15, 2026(expired)· nominal 20-yr term from priority
G02F 1/13625G02F 1/1362G02F 1/134336G02F 1/1333G02F 1/1337G02F 1/1343G02F 1/136236G02F 1/13712G02F 1/134372G09G 3/3648G09G 2310/0218G02F 1/133707G02F 1/136231G02F 1/134363G09G 2310/0283
56
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

A method of fabricating MVA active matrix substrate, and said substrate constituting an active matrix display device, characterized in that: a photolithographic procedure is performed three times for the manufacture: forming a gate electrode, a pixel electrode, a common electrode and a contact pad in said pixel electrode, forming a separate thin film semiconductor layer component, and a contact hole,forming a source electrode, a drain electrode and an orientation control electrode such that after an ohmic contact layer of a channel portion of said thin film transistor is dry etched, a partial film of a passivation layer is formed by a silicon nitride film by using a mask deposition method is provided.

Claims

exact text as granted — not AI-modified
1 . A method of fabricating MVA active matrix substrate, and said substrate constituting an active matrix display device, characterized in that: a photolithographic procedure is performed three times for the manufacture:
 (1) forming a gate electrode, a pixel electrode, a common electrode and a contact pad in said pixel electrode (wherein said photolithographic procedure using a halftone exposure method for the first time);   (2) forming a separate thin film semiconductor layer component, and a contact hole (wherein said photolithographic procedure using a halftone exposure method for the second time);   (3) forming a source electrode, a drain electrode and an orientation control electrode (wherein said photolithographic procedure using a general exposure method); such that after an ohmic contact layer of a channel portion of said thin film transistor is dry etched, a partial film of a passivation layer is formed by a silicon nitride film by using a mask deposition method (wherein said film is formed at a terminal portion other than those of a gate electrode, a source electrode and a common electrode).

Cited by (0)

No later patents cite this yet.

References (0)

No backward citations on record.