Heating exchange chamber for liquid state cooling fluid

Abstract

A heat exchange chamber for liquid state cooling fluid is provided, which comprises a flow resistance, the flow resistance is sited inside a cavity at a position proximate to an inlet. In other words, the flow resistance is sited between the inlet and a thermal dissipation device. The flow resistance narrows down a flow channel from the inlet to the cavity, and it raises the resistance of the cooling fluid before the cooling fluid flows through a thermal dissipation device. Because of the heat exchange chamber for liquid state cooling fluid, the cooling fluid could be distributed uniformly through the dissipating heat device.

1 . A heat exchange chamber, comprising:
 a casing, configured with a cavity, an inlet and an outlet in a manner that the inlet is provided for allowing a cooling fluid to flow into the cavity and the outlet is provided for allowing the cooling fluid to flow out of the cavity as the cooling fluid is enabled to flow in a flowing direction through of the cavity;   a thermal dissipation device, disposed inside the cavity; and   a flow resistance, disposed inside the cavity at a position proximate to the inlet to be used for narrowing down a flow channel from the inlet to the cavity.   
     
     
         2 . The heat exchange chamber of  claim 1 , wherein the diameter of the outlet is larger than that of the inlet. 
     
     
         3 . The heat exchange chamber of  claim 1 , wherein the flow resistance further comprises: a plurality of protrusions. 
     
     
         4 . The heat exchange chamber of  claim 3 , wherein the flow resistance further comprises: a plurality of flow channels, each being formed by the sandwiching of any two neighboring protrusions. 
     
     
         5 . The heat exchange chamber of  claim 4 , wherein each of the plural flow channels is composed of a diverging channel and a converging channel. 
     
     
         6 . The heat exchange chamber of  claim 1 , wherein the thermal dissipation device further comprises: a plate; and a plurality of heat dissipating fins formed on the plate. 
     
     
         7 . The heat exchange chamber of  claim 1 , wherein the casing further comprises: a base, being provided for engaging with a heat source while being arranged in thermal contact with the thermal dissipation device.