Serially-connected heat-dissipating fin assembly

Abstract

A serially-connected heat-dissipating fin assembly includes a plurality of heat-dissipating fins and a thermal-conducting element. Each of the heat-dissipating fins is provided with a hollow connecting portion for allowing the thermal-conducting element to be disposed through. The inner edge of the connecting portion of the respective heat-dissipating fins is provided with a protruding wall. The protruding wall is provided with a plurality of abutting portions slightly protruding toward the connecting portions. The surface of the thermal-conducting element is brought into frictional contact with the abutting portions to thereby tightly fit into the connecting portions of the respective heat-dissipating fins. With the interference fit between the respective abutting portions and the surface of the thermal-conducting element, it is unnecessary to use solders.

1 . A serially-connected heat-dissipating fin assembly, including:
 a plurality of heat-dissipating fins each provided with a hollow connecting portion; and   a thermal-conducting element disposed through the connecting portions of the heat-dissipating fins;   wherein an inner edge of the connecting portion of each heat-dissipating fin is provided with a protruding wall, the protruding wall is provided with a plurality of abutting portions slightly protruding toward the connecting portions, the surface of the thermal-conducting element is brought into friction contact with the abutting portions to thereby tightly fit into the connecting portions of the heat-dissipating fins.   
     
     
         2 . The serially-connected heat-dissipating fin assembly according to  claim 1 , wherein an outer edge of each heat-dissipating fin is bent to form a fold. 
     
     
         3 . The serially-connected heat-dissipating fin assembly according to  claim 1 , wherein the connecting portion is formed with an opening. 
     
     
         4 . The serially-connected heat-dissipating fin assembly according to  claim 1 , wherein the connecting portion further extends to one side of the heat-dissipating fin to form an opening. 
     
     
         5 . The serially-connected heat-dissipating fin assembly according to  claim 4 , wherein the protruding wall is formed into a U shape, both sides of the U-shaped protruding wall are formed into a stepped portion gradually widening from the opening toward the interior of the connecting portion. 
     
     
         6 . The serially-connected heat-dissipating fin assembly according to  claim 1 , wherein each of the abutting portions protrudes from the surface of the protruding wall by 3 to 5 μm. 
     
     
         7 . The serially-connected heat-dissipating fin assembly according to  claim 1 , wherein each of the abutting portions is formed into a boss. 
     
     
         8 . The serially-connected heat-dissipating fin assembly according to  claim 1 , wherein each of the abutting portions is formed with a notch on the protruding wall, the heat-dissipating fins are respectively provided with interference flanges slightly protruding toward the connecting portions corresponding to the notches. 
     
     
         9 . The serially-connected heat-dissipating fin assembly according to  claim 1 , wherein the thermal-conducting element is a heat pipe. 
     
     
         10 . The serially-connected heat-dissipating fin assembly according to  claim 1 , wherein the thermal-conducting element is a vapor chamber.