Light emitting diode package and projection apparatus

Abstract

A light emitting diode package including a carrier, at least one LED chip, and a light guide element. The LED chip is disposed on the carrier. The light guide element including a light transmissive body, a light integration part, a reflective film, and a support part is disposed on the carrier and located above the LED chip. The light integration part connected to the light transmissive body and disposed between the light transmissive body and the LED chip has a light incident surface facing the LED chip and at least one side surface. The side surface connects the light transmissive body and the light incident surface. The reflective film is disposed on the side surface. The support part leaning on the carrier is connected to the light transmissive body and surrounds the light integration part. The light transmissive body, the light integration part, and the support part are integrally formed.

1 . A light emitting diode package, comprising:
 a carrier;   at least one light emitting diode chip, disposed on the carrier; and   a light guide element, disposed on the carrier and located above the light emitting diode chip, the light guide element comprising:
 a light transmissive body in a shape of a planar plate; 
 a light integration part, connected to the light transmissive body and disposed between the light transmissive body and the light emitting diode chip, the light integration part comprising:
 a light incident surface facing the light emitting diode chip; and 
 at least one side surface connecting the light transmissive body and the light incident surface; 
 
 a reflective film, disposed on the side surface; and 
 a support part, connected to the light transmissive body and surrounding the light integration part, wherein the support part leans on the carrier, and the light transmissive body, the light integration part, and the support part are integrally formed. 
   
     
     
         2 . The light emitting diode package according to  claim 1 , wherein the light integration part is quadrangular-rod-shaped. 
     
     
         3 . The light emitting diode package according to  claim 1 , wherein an area of a cross section of the light integration part parallel to the light incident surface increases progressively along a direction from the light incident surface to the light transmissive body. 
     
     
         4 . The light emitting diode package according to  claim 1 , wherein the carrier has a protrusion part surrounding the light emitting diode chip, and the support part leans on the protrusion part. 
     
     
         5 . The light emitting diode package according to  claim 4 , wherein the protrusion part has a first micro protrusion structure protruding toward the light guide element, the support part has a second micro protrusion structure protruding toward the carrier, the second micro protrusion structure leans on the first micro protrusion structure, and the second micro protrusion structure is disposed between the light integration part and the first micro protrusion structure or the first micro protrusion structure is disposed between the light integration part and the second micro protrusion structure. 
     
     
         6 . The light emitting diode package according to  claim 1 , wherein an interval is kept between the light incident surface and the light emitting diode chip, and the interval falls within a range of 0.05 millimeters to 1 millimeter. 
     
     
         7 . A projection apparatus, comprising:
 a light emitting diode package, comprising:
 a carrier; 
 at least one light emitting diode chip, disposed on the carrier and capable of emitting an illumination beam; and 
 a light guide element, disposed on the carrier and located above the light emitting diode chip, the light guide element comprising:
 a light transmissive body in a shape of a planar plate; 
 a light integration part, connected to the light transmissive body and disposed between the light transmissive body and the light emitting diode chip, wherein the illumination beam is capable of passing through the light integration part and the light transmissive body sequentially, and the light integration part comprises:
 a light incident surface facing the light emitting diode chip; and 
 at least one side surface, connecting the light transmissive body and the light incident surface; 
 
 a reflective film, disposed on the side surface; and 
 a support part, connected to the light transmissive body and surrounding the light integration part, wherein the support part leans on the carrier, and the light transmissive body, the light integration part, and the support part are integrally formed; 
 
   a light valve, disposed in a light path of the illumination beam from the light transmissive body and capable of converting the illumination beam into an image beam; and   a projection lens, disposed in a light path of the image beam.   
     
     
         8 . The projection apparatus according to  claim 7 , wherein the light integration part is quadrangular-rod-shaped. 
     
     
         9 . The projection apparatus according to  claim 7 , wherein an area of a cross section of the light integration part parallel to the light incident surface increases progressively along a direction from the light incident surface to the light transmissive body. 
     
     
         10 . The projection apparatus according to  claim 7 , wherein the carrier has a protrusion part surrounding the light emitting diode chip, and the support part leans on the protrusion part. 
     
     
         11 . The projection apparatus according to  claim 10 , wherein the protrusion part has a first micro protrusion structure protruding toward the light guide element, the support part has a second micro protrusion structure protruding toward the carrier, the second micro protrusion structure leans on the first micro protrusion structure, and the second micro protrusion structure is disposed between the light integration part and the first micro protrusion structure or the first micro protrusion structure is disposed between the light integration part and the second micro protrusion structure. 
     
     
         12 . The projection apparatus according to  claim 7 , wherein an interval is kept between the light incident surface and the light emitting diode chip, and the interval falls within a range of 0.05 millimeters to 1 millimeter.