Flexible circuit chemistry

Abstract

The present invention provides a circuit creation technology that improves conductive line manufacture by adding active and elemental palladium onto the surface of a substrate. The palladium is disposed in minute amounts on the surface and does not form a conductive layer by itself, but facilitates subsequent deposition of a metal onto the surface, according to the pattern of the palladium, to form the conductive lines.

1 . A method for producing active palladium on a substrate, the method comprising:
 depositing a palladium precursor solution onto the substrate, wherein the palladium precursor solution includes a palladium compound in a solvent;   exposing the palladium precursor solution to conditions that promote evaporation of the solvent from the palladium precursor solution to leave a palladium precursor on the substrate; and   decomposing the palladium precursor on the substrate to produce active palladium, wherein the active palladium is monatomically disposed on the substrate in the form of single isolated atoms.   
     
     
         2 . The method of  claim 1 , wherein the active palladium does not by itself form a conductive layer on the substrate. 
     
     
         3 . The method of  claim 1 , wherein the active palladium has a concentration of less than about 6×10 −10  gram atoms of palladium per square millimeter. 
     
     
         4 . The method of  claim 1 , wherein depositing the palladium precursor solution onto the substrate includes patterning the palladium precursor solution to substantially define an active palladium pattern. 
     
     
         5 . The method of  claim 1 , wherein decomposing the palladium precursor includes transferring heat to the substrate. 
     
     
         6 . The method of  claim 1 , wherein decomposing the palladium precursor includes transferring electromagnetic radiation to the substrate or the palladium precursor. 
     
     
         7 . The method of  claim 1 , wherein the substrate is flexible. 
     
     
         8 . The method of  claim 1 , wherein the substrate has a thickness less than about 2 millimeters. 
     
     
         9 . The method of  claim 1 , wherein the palladium precursor solution includes at least palladium propionate, amyl acetate and cyclopentylamine 
     
     
         10 . The method of  claim 1 , wherein said resulting palladium precursor disposed on the substrate has a valence of about zero. 
     
     
         11 . A method for producing active palladium on a substrate, the method comprising:
 providing a solution comprising palladium propionate, amyl acetate and cyclopentylamine;   depositing at least a portion of the solution onto the substrate;   removing all solvent from the solution to leave a palladium precursor on the substrate; and   decomposing the palladium precursor to leave active palladium on the substrate.   
     
     
         12 . The method of  claim 11 , wherein the active palladium is monatomically disposed on the substrate in the form of single isolated atoms. 
     
     
         13 . The method of  claim 11 , wherein the active palladium does not by itself form a conductive layer on the substrate. 
     
     
         14 . The method of  claim 11 , wherein said depositing includes patterning the solution to result in a substantially defined pattern of palladium. 
     
     
         15 . The method of  claim 1 , wherein said depositing includes the use of a printing apparatus. 
     
     
         16 . A method for producing a metallic precursor on a substrate, the method comprising:
 depositing a metallic precursor solution onto the substrate, wherein the metallic precursor solution includes a metal compound in a solvent;   exposing the metallic precursor solution to conditions that promote evaporation of the solvent from the metallic precursor solution to leave a metallic precursor on the substrate; and   decomposing the metallic precursor on the substrate to produce an active metal, wherein the active metal is monatomically disposed on the substrate in the form of single isolated atoms.   
     
     
         17 . The method of  claim 16 , wherein said active metal comprises palladium. 
     
     
         18 . The method of  claim 16 , wherein the active metal does not by itself form a conductive layer on the substrate. 
     
     
         19 . The method of  claim 16 , wherein said depositing includes patterning the solution to result in a substantially defined pattern of metal. 
     
     
         20 . The method of  claim 16 , wherein said depositing includes the use of a printing apparatus.