Heat dissipation device

Abstract

A heat dissipation device used to dissipate heat generated by a memory, includes a first cooling fin for being attached to a first side of the memory, a second cooling fin for being attached to a second side of the memory opposite to the first side. There is also a clamp to sandwich the combined assembly of the first cooling fin, the memory, and the second cooling fin. Further included are two fasteners respectively pivotably mounted to the first and second cooling fins, and latched to the clamp to make the first and second cooling fins tightly resist against the first and second sides of the memory respectively.

1 . A heat dissipation device used to dissipate heat generated by a memory, the heat dissipation device comprising:
 a first cooling fin for being attached to a first side of the memory;   a second cooling fin for being attached to a second side of the memory opposite to the first side;   a clamp to sandwich the combined assembly of the first cooling fin, the memory, and the second cooling fin; and   two fasteners for being respectively and pivotably mounted to the first and second cooling fins, and latched to the clamp, to make the first and second cooling fins tightly resisting against the first and second sides of the memory respectively.   
     
     
         2 . The heat dissipation device of  claim 1 , wherein the clamp comprises a substantially rectangular top plate and two lateral plates extending down from opposite sides of the top plate, the first and second cooling fins are to be tightly clamped by the lateral plates. 
     
     
         3 . The heat dissipation device of  claim 2 , wherein the top plate is convex in cross section, forming a shallow trough along the length thereof. 
     
     
         4 . The heat dissipation device of  claim 2 , wherein a top of each of the lateral plates forms an arc-shaped connection portion connected to the corresponding side of the top plate. 
     
     
         5 . The heat dissipation device of  claim 2 , wherein two latches extend from opposite ends of an outer surface of each of the lateral plates, a top surface of each of the latches defines a slot along a length of the lateral plate, each of the fasteners is to be latched in the slots of the corresponding lateral plate. 
     
     
         6 . The heat dissipation device of  claim 5 , wherein outer surfaces of the first and second cooling fins each form two blocks, each of the blocks defines a pivot hole, distal ends of the fasteners are pivotably engaged in the pivot holes of the first and second cooling fins. 
     
     
         7 . The heat dissipation device of  claim 6 , wherein each of the fasteners comprises a substantially U-shaped main body and two pivot pins extending from opposite distal ends of the main body, the main body comprises a resisting pole firmly latched in the slots of the corresponding lateral plate, and two connection poles substantially perpendicularly extending up from opposite ends of the resisting pole, the pivot pins substantially extend from distal ends of the connection poles away from each other, to engage in the corresponding pivot holes of a corresponding one of the first and second cooling fins. 
     
     
         8 . The heat dissipation device of  claim 1 , wherein the second cooling fins is pivotably mounted to the first cooling fin. 
     
     
         9 . The heat dissipation device of  claim 8 , wherein two first pivot tabs substantially perpendicularly extend from a top side of the first cooling fin, facing the second cooling fin, each of the first pivot tabs comprises a pivot pin extending toward the other first pivot tab, and two second pivot tabs substantially perpendicularly extend from a top side of the second cooling fin, facing the first cooling fin, each of the second pivot tabs defines a pivot hole opposite to the other second pivot tab, the pivot pins are pivotably engaged in the corresponding pivot holes. 
     
     
         10 . A heat dissipation device used to dissipate heat generated by memory, the heat dissipation device comprising:
 a first cooling fin for being attached to a first side of the memory;   a second cooling fin for being attached to a second side of the memory opposite to the first side; and   an elastic clamp comprising two opposite lateral plates to respectively and tightly contact the first and second cooling fins to sandwich the combined assembly of the first cooling fin, the memory, and the second cooling fin.   
     
     
         11 . The heat dissipation device of  claim 10 , wherein the clamp further comprises a top plate connected between tops of the lateral plates. 
     
     
         12 . The heat dissipation device of  claim 11 , wherein the top plate is convex in cross section, forming a shallow trough along the length thereof. 
     
     
         13 . The heat dissipation device of  claim 11 , wherein a top of each lateral plate forms an arc-shaped connection portion connected to the corresponding side of the top plate. 
     
     
         14 . The heat dissipation device of  claim 10 , wherein the first connection fin is pivotably connected to the second connection pin. 
     
     
         15 . The heat dissipation device of  claim 14 , wherein a top side of the first connection fin is pivotably connected to a top side of the second connection fin. 
     
     
         16 . The heat dissipation device of  claim 15 , wherein two first pivot tabs substantially perpendicularly extend from the top side of the first cooling fin toward the second cooling fin, a pivot pin extends from each first pivot tab; two second pivot tabs substantially perpendicularly extend from the top side of the second cooling fin toward the first cooling fin, each second pivot tab defines a pivot hole to pivotably receive a corresponding pivot pin of the first cooling fin.