Tape for holding chip, method of holding chip-shaped workpiece, method of manufacturing semiconductor device using tape for holding chip, and method of manufacturing tape for holding chip

Abstract

The present invention aims to provide a tape for holding a chip that makes pasting and peeling of a chip-shaped workpiece easy. It is a tape for holding a chip having a configuration in which a pressure-sensitive adhesive layer is formed on a base material, wherein the pressure-sensitive adhesive layer has a chip-shaped workpiece pasting region onto which a chip-shaped workpiece is pasted and a frame pasting region onto which a mount frame is pasted, and that is used by pasting the mount frame to the frame pasting region, wherein the 180-degree peeling adhesive power of the pressure-sensitive adhesive layer to a silicon mirror wafer at the frame pasting region is 5 times or more the 180-degree peeling adhesive power of the pressure-sensitive adhesive layer to a silicon mirror wafer at the chip-shaped workpiece pasting region.

1 . A tape for holding a chip, wherein the tape has a configuration in which a pressure-sensitive adhesive layer is formed on a base material, wherein the pressure-sensitive adhesive layer has a chip-shaped workpiece pasting region onto which a chip-shaped workpiece is pasted and a frame pasting region, wherein
 the pressure-sensitive adhesive layer is characterized in that, when the pressure-sensitive adhesive layer is adhered to a silicon mirror wafer a 180-degree peeling adhesive power of the pressure-sensitive adhesive layer in the frame pasting region is 5 times or more as compared to the 180-degree peeling adhesive power of the pressure-sensitive adhesive layer in the chip-shaped workpiece pasting region when measured at a temperature of 23±3° C. and a tensile speed of 300 mm/min, and   the pressure-sensitive adhesive layer is the outermost layer on one side of said tape.   
     
     
         2 . The tape according to  claim 1 , wherein
 the 180-degree peeling adhesive power of the pressure-sensitive adhesive layer in the chip-shaped workpiece pasting region is 0.01 to 0.1N/20-mm tape width when measured at the temperature of 23±3° C. and the tensile speed of 300 mm/min.   
     
     
         3 . The tape according to  claim 1 , wherein
 the Young's modulus of the pressure-sensitive adhesive layer at the chip-shaped workpiece pasting region is 3 MPa or more.   
     
     
         4 . The tape according to  claim 1 , wherein the pressure-sensitive adhesive layer is radiation curable, wherein
 the chip-shaped workpiece pasting region is formed in a manner that the 180-degree peeling adhesive power of the adhesive power is reduced by curing exposure to radiation.   
     
     
         5 . The tape according to  claim 1 , wherein
 the pressure-sensitive adhesive layer is formed such that a strong pressure-sensitive adhesive layer having the frame pasting region on the surface and a weak pressure-sensitive adhesive layer having the chip-shaped workpiece pasting region on the surface are not laminated on each other on the base.   
     
     
         6 . The tape according to  claim 1 , wherein
 the pressure-sensitive adhesive layer has a strong pressure-sensitive adhesive layer and a weak pressure-sensitive adhesive layer that is laminated on the strong pressure-sensitive adhesive layer such that the outer circumference part of the strong pressure-sensitive adhesive layer is exposed,   the portion where the strong pressure-sensitive adhesive layer is exposed corresponds to the frame pasting region, and   the surface of the weak pressure-sensitive adhesive layer corresponds to the chip-shaped workpiece pasting region.   
     
     
         7 . The tape according to  claim 1 , wherein
 the pressure-sensitive adhesive layer has a weak pressure-sensitive adhesive layer and a strong pressure-sensitive adhesive layer that is laminated on the weak pressure-sensitive adhesive layer such that the center portion of the weak pressure-sensitive adhesive layer is exposed,   the surface of the strong pressure-sensitive adhesive layer corresponds to the frame pasting region, and   the portion where the weak pressure-sensitive adhesive layer is exposed corresponds to the chip-shaped workpiece pasting region.   
     
     
         8 - 10 . (canceled) 
     
     
         11 . A method of manufacturing the tape for holding a chip of  claim 4 , comprising
 a pressure-sensitive adhesive layer forming step of forming a radiation curable pressure-sensitive adhesive layer and   a radiation irradiation step of forming the chip-shaped workpiece pasting region having a reduced adhesive power, wherein the radiation irradiation step comprises curing the chip-shaped workpiece pasting region of the pressure-sensitive adhesive layer by irradiation but not curing the frame pasting region such that the 180-degree peeling adhesive power of the uncured frame pasting region is not reduced.   
     
     
         12 . The method according to  claim 11 , comprising
 a radiation shielding layer forming step of forming a radiation shielding layer having a radiation shielding function on a portion corresponding to the frame pasting region of the radiation curable pressure-sensitive adhesive layer that is laminated on the base, wherein   the radiation irradiation step is a step of forming the chip-shaped workpiece pasting region having a reduced adhesive power by curing a portion of the radiation curable pressure-sensitive adhesive layer corresponding to the chip-shaped workpiece pasting region by irradiation with radiation from the surface of the base and the uncured frame pasting region of which the adhesive power is not reduced.   
     
     
         13 . The method according to  claim 12 , wherein
 the radiation shielding layer forming step is a step of forming the radiation shielding layer using a printing method.   
     
     
         14 . A tape for holding a chip having a configuration in which a pressure-sensitive adhesive layer is formed on a base material and a separator is formed on the pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer has a chip-shaped workpiece pasting region and a frame pasting region, wherein
 the pressure-sensitive adhesive layer is characterized in that, when the pressure-sensitive adhesive layer is adhered to a silicon mirror wafer a 180-degree peeling adhesive power of the pressure-sensitive adhesive layer in the frame pasting region is 5 times or more as compared to the 180-degree peeling adhesive power of the pressure-sensitive adhesive layer in the chip-shaped workpiece pasting region when measured at a temperature of 23±3° C. and a tensile speed of 300 mm/min.