Led package with stepped aperture

Abstract

A light emitting diode (LED) package for high temperature operation which includes a printed wire board and a heat sink. The LED package may include a formed heat sink layer, which may be thermally coupled to an external heat sink. The printed wire board may include apertures that correspond to the heat sink such that the heat sink is integrated with the printed wire board layer. The LED package may include castellations for mounting the package on a secondary component such as a printed wire board. The LED package may further comprise an isolator disposed between a base metal layer and one or more LED die. The LED package may include a PWB assembly having a stepped cavity, in which one or more LED die are disposed.

1 . A method of fabricating a multi-layer PWB assembly, comprising:
 providing a plurality of PWB layers, wherein each PWB layer includes at least one metal layer and at least one dielectric layer;   patterning the at least one metal layer of the plurality of PWB layer;   forming apertures in each PWB layer, the apertures being aligned and sized to form one or more stepped cavities when the PWB layers are laminated together into a multi-layer assembly; and,   laminating the plurality of PWB layers together to form a multi-layer PWB assembly having one or more stepped cavities.   
     
     
         2 . The method of  claim 1 , wherein the laminating step comprises disposing a laminate layer in between the PWB layers. 
     
     
         3 . The method of  claim 2 , wherein the laminate layer comprises a pre-punched pre-preg material. 
     
     
         4 . The method of  claim 3 , further comprising providing one or more plated vias through the multi-layer PWB assembly. 
     
     
         5 . The method of  claim 2 , wherein the laminate layer comprises a pressure sensitive adhesive. 
     
     
         6 . The method of  claim 1 , further comprising providing one or more vias through the multi-layer PWB assembly. 
     
     
         7 . The method of  claim 6 , further comprising plating the one or more vias. 
     
     
         8 . A method of fabricating a LED package, comprising:
 disposing a multi-layer PWB assembly including a stepped cavity on an insulating layer, the insulating layer having an aperture in registration with the stepped cavity;   laminating the multi-layer PWB assembly, the insulating layer, and a metal base together; and,   disposing one or more LED die in the stepped cavity.   
     
     
         9 . The method of  claim 8 , wherein the one or more LED die are disposed on the metal base. 
     
     
         10 . The method of  claim 9 , wherein the one or more LED die are mounted on an isolator disposed on the metal base. 
     
     
         11 . The method of  claim 10 , wherein the isolator is composed of a material having a TCE approximately equal to the TCE of the one or more LED die. 
     
     
         12 . The method of  claim 8 , wherein the insulating layer comprises a dielectric material. 
     
     
         13 . The method of  claim 8 , wherein the insulating layer comprises a high temperature fiberglass reinforced material. 
     
     
         14 . The method of  claim 8 , wherein the insulating layer comprises one or more layers of laminate material. 
     
     
         15 . The method of  claim 14 , wherein the one or more layers of laminate material comprise pre-punched pre-preg material. 
     
     
         16 . The method of  claim 14 , wherein the one or more layers of laminate material comprise pressure sensitive adhesive. 
     
     
         17 . The method of  claim 8 , further comprising disposing an encapsulant over at least a portion of the one or more LED die. 
     
     
         18 . The method of  claim 8 , further comprising attaching a reflector to the multi-layer PWB assembly. 
     
     
         19 . The method of  claim 8 , further comprising disposing one or more dams between the one or more layers of laminate material and the stepped cavity to prevent the laminate material from entering the stepped cavity during the lamination step.