Light source and backlight module having the same

Abstract

A light source includes a carrier, a plurality of solid-state light-emitting devices, a plate photo-coupler, a first reflector, and a plurality of second reflectors. The solid-state light-emitting devices and the light-incoupling component are configured on the carrier. The light-incoupling component has a bottom surface, a top surface, a plurality of side surfaces adjoining the bottom surface and the top surface, and a through hole extending from the bottom surface to the top surface. The solid-state light-emitting devices are located in the through hole. The first reflector covers the through hole. The second reflectors are configured on the side surfaces. Light emitted from the solid-state light-emitting devices enters the light-incoupling component via a sidewall of the through hole and leaves the light-incoupling component via the top surface thereof.

1 . A light source comprising:
 a carrier;   a plurality of solid-state light-emitting devices configured on the carrier;   a light-incoupling component configured on the carrier, the light-incoupling component having a bottom surface, a top surface, a plurality of side surfaces adjoining the bottom surface and the top surface, and a through hole extending from the bottom surface to the top surface, the solid-state light-emitting devices being located in the through hole;   a first reflector covering the through hole; and   a plurality of second reflectors configured on the side surfaces of the plate photo-coupler, wherein light emitted from the solid-state light-emitting devices enters the light-incoupling component via a sidewall of the through hole and leaves the light-incoupling component via the top surface of the plate photo-coupler.   
     
     
         2 . The light source as claimed in  claim 1 , wherein the carrier comprises a circuit board. 
     
     
         3 . The light source as claimed in  claim 1 , wherein the solid-state light-emitting devices comprise side-view light-emitting diode (LED) packages. 
     
     
         4 . The light source as claimed in  claim 1 , wherein each of the solid-state light-emitting devices has a light-emitting surface, and each of the light-emitting surfaces faces the sidewall of the through hole. 
     
     
         5 . The light source as claimed in  claim 1 , wherein a shape of the first reflector and a shape of the through hole are substantially the same. 
     
     
         6 . The light source as claimed in  claim 1 , wherein the through hole comprises a circular through hole, an elliptical through hole, or a polygonal through hole. 
     
     
         7 . The light source as claimed in  claim 1 , wherein the sidewall of the through hole comprises a plurality of curved surfaces. 
     
     
         8 . The light source as claimed in  claim 1 , wherein the first reflector is a reflective plate, and the first reflector and the top surface of the light-incoupling component are substantially on the same plane. 
     
     
         9 . The light source as claimed in  claim 8 , wherein a gap is between the first reflector and the solid-state light-emitting devices. 
     
     
         10 . The light source as claimed in  claim 1 , wherein the second reflectors comprise a plurality of reflective plates or a plurality of reflective coatings. 
     
     
         11 . The light source as claimed in  claim 1 , further comprising an optical filler filling the through hole and encapsulating the solid-state light-emitting devices, a refractive index of the optical filler is different from a refractive index of the plate photo-coupler. 
     
     
         12 . The light source as claimed in  claim 1 , further comprising a third reflective layer configured between the carrier and the bottom surface of the plate photo-coupler. 
     
     
         13 . A backlight module comprising:
 at least one light source as claimed in  claim 1 ;   a light guide plate having a light-incident surface and a light-emitting surface opposite to the light-incident surface;   at least one optical clear adhesive, the first reflector of the at least one light source and the top surface of the light-incoupling component being adhered to the light-incident surface of the light guide plate via the at least one optical clear adhesive.   
     
     
         14 . The backlight module as claimed in  claim 13 , wherein the carrier comprises a circuit board. 
     
     
         15 . The backlight module as claimed in  claim 13 , wherein the solid-state light-emitting devices comprise side-view light-emitting diode (LED) packages. 
     
     
         16 . The backlight module as claimed in  claim 13 , wherein each of the solid-state light-emitting devices has a light-emitting surface, and each of the light-emitting surfaces faces the sidewall of the through hole. 
     
     
         17 . The backlight module as claimed in  claim 13 , wherein a shape of the first reflector and a shape of the through hole are substantially the same. 
     
     
         18 . The backlight module as claimed in  claim 13 , wherein the through hole comprises a circular through hole, an elliptical through hole, or a polygonal through hole. 
     
     
         19 . The backlight module as claimed in  claim 13 , wherein the sidewall of the through hole comprises a plurality of curved surfaces. 
     
     
         20 . The backlight module as claimed in  claim 13 , wherein the first reflector is a reflective plate, and the first reflector and the top surface of the light-incoupling component are substantially on the same plane. 
     
     
         21 . The backlight module as claimed in  claim 20 , wherein a gap is between the first reflector and the solid-state light-emitting devices. 
     
     
         22 . The backlight module as claimed in  claim 13 , wherein the second reflectors comprise a plurality of reflective plates or a plurality of reflective coatings. 
     
     
         23 . The backlight module as claimed in  claim 13 , wherein the at least one light source further comprises an optical filler filling the through hole and encapsulating the solid-state light-emitting devices, a refractive index of the optical filler is different from a refractive index of the plate photo-coupler. 
     
     
         24 . The backlight module as claimed in  claim 13 , wherein the at least one light source further comprises a third reflective layer configured between the carrier and the bottom surface of the plate photo-coupler. 
     
     
         25 . The backlight module as claimed in  claim 13 , wherein a top surface of the light guide plate has a plurality of optical micro-structures. 
     
     
         26 . The backlight module as claimed in  claim 13 , wherein a bottom surface of the light guide plate has a plurality of optical micro-structures.