Device and method for processing substrate, and method for producing a processed substrate

Abstract

Disclosed are a simple device for processing substrate which can make a surface of a processed substrate smooth, a method for processing substrate with the use of the processing device, and a method for producing a processed substrate with the use of the processing method. The device of the present invention for processing a substrate includes a jetting member ( 12 ) provided so that a jetting angle of abrasive grains ( 12 a ) with respect to a processed surface of the substrate ( 1 ) becomes an angle for brittleness processing, the jetting member ( 12 ) jetting the abrasive grains ( 12 a ); and a jetting direction changing member ( 18 ) provided between the jetting member ( 12 ) and the processed surface of the substrate ( 1 ) in a jetting direction of the abrasive grains ( 12 a ), the jetting direction changing member ( 18 ) changing an angle at which the abrasive grains ( 12 a ) enter the processed surface of the substrate ( 1 ) from the angle for the brittleness processing to an angle for ductility processing, the jetting direction changing member ( 18 ) being movable.

1 . A device for processing a substrate, comprising:
 a jetting member provided so that a jetting angle of abrasive grains with respect to a processed surface of the substrate becomes an angle for brittleness processing, the jetting member jetting the abrasive grains; and   a jetting direction changing member provided between the jetting member and the processed surface of the substrate in a jetting direction of the abrasive grains, the jetting direction changing member changing an angle at which the abrasive grains enter the processed surface of the substrate from the angle for the brittleness processing to an angle for ductility processing,   the jetting direction changing member being movable.   
     
     
         2 . The device according to  claim 1 , further comprising a rotating member for rotating the jetting direction changing member around a normal to the processed surface which normal passes through the jetting direction changing member. 
     
     
         3 . The device according to  claim 1 , further comprising a jetting direction controlling member for controlling an angle of the jetting direction changing member with respect to a normal to the processed surface which normal passes through the jetting direction changing member. 
     
     
         4 . The device according to  claim 1 , wherein the jetting direction changing member contains at least one of silicon carbide and silicon nitride. 
     
     
         5 . The device according  claim 1 , wherein:
 the substrate is a glass substrate, and   the abrasive grains are made of alumina.   
     
     
         6 . The device according to  claim 1 , wherein (i) jetting of the abrasive grains and a medium for jetting the abrasive grains and (ii) jetting of only the medium are alternately carried out. 
     
     
         7 . The device according to  claim 1 , wherein a processed portion of the substrate is filled with a transparent material. 
     
     
         8 . The device according to  claim 1 , wherein the substrate is for constituting a liquid crystal display panel. 
     
     
         9 . A method for processing a substrate with use of a device as set forth in  claim 1 , comprising the steps of:
 performing brittleness processing with respect to the substrate; and   performing ductility processing with respect to the substrate after the brittleness processing.   
     
     
         10 . A method for producing a processed substrate, comprising the step of using the method as set forth in  claim 9 .