Heat transfer systems and methods

Abstract

Heat transfer apparatuses and systems are provided. A heat transfer apparatus ( 100 ) can include a thermal conduit ( 110 ) having a first end ( 120 ) and a second end ( 130 ). The thermal conduit can be disposed at least partially within an electronic device enclosure ( 140 ). A non-heat conductive material ( 150 ) can be disposed at least partially about at least a portion of the thermal conduit.

1 . A heat transfer apparatus comprising:
 a thermal conduit having a first end and a second end;
 wherein the thermal conduit is disposed at least partially within an electronic device enclosure; and 
   a non-heat conductive material disposed at least partially about at least a portion of the thermal conduit.   
     
     
         2 . The apparatus of  claim 1 , wherein the thermal conduit comprises a hollow, sealed, metallic member. 
     
     
         3 . The apparatus of  claim 1 , wherein the non-heat conductive material is selected from the group of materials consisting of: a woven fiberglass material, a woven silica material, a woven mineral wool material, a foil backed woven fiberglass material, a foil backed woven silica material, and a foil backed woven mineral wool material. 
     
     
         4 . The apparatus of  claim 1 , wherein the non-heat conductive material comprises a coating disposed about the thermal conduit. 
     
     
         5 . The apparatus of  claim 1 , wherein at least a portion of the first end of the thermal conduit is thermally connected to a heat-producing device. 
     
     
         6 . The apparatus of  claim 1 , wherein at least a portion of the second end of the thermal conduit is thermally connected to a heat-dissipating device. 
     
     
         7 . A heat transfer method comprising:
 disposing a non-heat conductive material about at least a portion of a thermal conduit;
 wherein the thermal conduit comprises a member having a first end and, a second end; 
   thermally connecting the first end of the thermal conduit to a heat producing device; and   thermally connecting the second end of the thermal conduit to a heat dissipating device.   
     
     
         8 . The method of  claim 7 , wherein the non-heat conductive material is selected from the group of materials consisting of: a woven fiberglass material, a woven silica material, a woven mineral wool material, a foil backed woven fiberglass material, a foil backed woven silica material, and a foil backed woven mineral wool material. 
     
     
         9 . The method of  claim 7 , wherein the non-heat conductive material comprises a coating disposed at least partially about the thermal conduit. 
     
     
         10 . The method of  claim 7 , wherein the heat dissipating device comprises a passive radiator. 
     
     
         11 . The method of  claim 7 , further comprising:
 disposing a wicking material about at least a portion of the interior of the thermal conduit; and   disposing a heat transfer fluid within at least a portion of the thermal conduit.   
     
     
         12 . A heat transfer system; comprising:
 a heat producing device disposed at least partially within an electronic device enclosure;   a heat dissipating device disposed at least partially within the electronic device enclosure;   a thermal conduit having a first end and a second, end;
 wherein a non-heat conductive material is disposed at least partially about at least a portion of the thermal conduit; 
   wherein the first end of the thermal conduit is thermally connected to the heat producing electronic device; and   wherein the second end of the thermal conduit is thermally connected to the heat dissipating device.   
     
     
         13 . The system of  claim 12 , wherein the non-heat conductive material comprises a material selected from the group of non-heat conductive materials consisting of: a flexible non-heat conductive material disposed helically about the thermal conduit, a non-heat conductive coating disposed about the thermal conduit, and a non-heat conductive sleeve disposed about the thermal conduit. 
     
     
         14 . The system of  claim 12 ;
 wherein the electronic device enclosure comprises an enclosure disposed at least partially about a computing device;   wherein the heat producing electronic device comprises an integrated circuit; and   wherein the heat dissipating electronic device comprises an extended-surface radiator.   
     
     
         15 . The system of  claim 12  further comprising an air mover having an air discharge wherein at least a portion of the air discharge passes across the heat dissipating device.