Systems and methods for thermal management of electronic components

Abstract

The device for extracting heat from carbon nanotubes wires or cables used under high power applications is provided. The device can include a thermally conductive member for placement against a heat source and for directing heat away from the heat source to a heat dissipating medium. The device can further include an electrically conductive member positioned on the thermally conductive member and made from a layer of carbon nanotubes, to reduce electrical resistance along the electrically conductive member. A geometric pattern can be imparted to the electrically conductive member to enhance dissipation of heat away from the thermally conductive member and the heat source.

1 . A device, comprising:
 a thermally conductive member for directing heat away from a heat source;   an electrically conductive member positioned about the thermally conductive member and made from a layer of carbon nanotubes to reduce electrical resistance along the electrically conductive member; and   a geometric pattern imparted to the electrically conductive member to enhance dissipation of heat away from the thermally conductive member.   
     
     
         2 . The device as set forth in  claim 1 , wherein the thermally conductive member is made from a material having a relatively high thermal conductivity characteristic. 
     
     
         3 . The device as set forth in  claim 1 , wherein the thermally conductive member is made from a material having a heat spreading characteristic. 
     
     
         4 . The device as set forth in  claim 1 , wherein the thermally conductive member is made from one of graphite fiber, film or foil, or a combination thereof. 
     
     
         5 . The device a set forth in  claim 1 , wherein the thermally conductive member comprises a porous mesh to enhance dissipation of heat from the heat source. 
     
     
         6 . The device as set forth in  claim 1 , wherein the electrically conductive member is circumferentially situated about the thermally conductive member. 
     
     
         7 . The device as set forth in  claim 1 , wherein the electrically conductive member is made from one of individual and conductive yarns, fibers, wires, sheets, mat or textile material. 
     
     
         8 . The device as set forth in  claim 1 , wherein the electrically conductive member is braided or woven about the thermally conductive member. 
     
     
         9 . The device as set forth in  claim 1 , wherein the electrically conductive member forms a sheet and is laminated onto the thermally conductive member. 
     
     
         10 . The device as set forth in  claim 1 , wherein the geometric pattern imparted to the electrically conductive member is a lattice circumferentially situated about the thermally conductive member. 
     
     
         11 . The device as set forth in  claim 1 , wherein the geometric pattern imparted to the electrically conductive member includes a plurality of electrically conductive layers circumferentially situated about the thermally conductive member. 
     
     
         12 . The device as set forth in  claim 1 , wherein the geometric pattern imparted to the electrically conductive member includes a plurality of layers spirally wound upon itself 
     
     
         13 . The device as set forth in  claim 1 , further including fins to help facilitate the transfer of heat away from the heat source. 
     
     
         14 . The device as set forth in  claim 1 , further comprising an adhesive material between the thermally conductive member and the electrically conductive member. 
     
     
         15 . The device as set forth in  claim 1  for use as an electrical conductor. 
     
     
         16 . The device as set forth in  claim 1 , wherein the conductor is incorporated as part of a cable or cable assembly. 
     
     
         17 . The device as set forth in  claim 1 , wherein the conductor is incorporated as part of a coaxial cable. 
     
     
         18 . A method of dissipating heat, the method comprising:
 (a) situating a thermally conductive layer against a heat source to dissipate heat from the heat source;   (b) positioning an electrically conductive layer about the thermally conductive layer; and   (c) imparting a pattern to the electrically conductive layer to enhance dissipation of heat away from the heat source.   
     
     
         19 . The method of  claim 18 , wherein in the step of placing, the heat source is a conductor.