Modem Unit and Mobile Communication Unit

Abstract

A modem unit includes a first semiconductor die that includes a power management unit and an embedded flash memory. A mobile communication unit includes a modem unit residing on a first semiconductor die. The first semiconductor die also includes a power management unit and an embedded flash memory.

1 . A modem unit, comprising
 a first semiconductor die comprising a power management unit and an embedded flash memory.   
     
     
         2 . The modem unit according to  claim 1 , further comprising:
 a baseband unit coupled to the power management unit.   
     
     
         3 . The modem unit according to  claim 2 , wherein the baseband unit is arranged on a second semiconductor die. 
     
     
         4 . The modem unit according to  claim 1 , wherein in the embedded flash memory one or more of calibration data, network parameters, security data and debug data are stored. 
     
     
         5 . The modem unit according to  claim 2 , further comprising:
 a radio frequency unit coupled to the baseband unit.   
     
     
         6 . The modem unit according to  claim 5 , wherein the radio frequency unit is arranged on the second semiconductor die or on a third semiconductor die. 
     
     
         7 . A mobile communication unit, comprising:
 a modem unit comprising a first semiconductor die, the first semiconductor die comprising a power management unit and an embedded flash memory.   
     
     
         8 . The mobile communication unit according to  claim 7 , further comprising:
 an application unit coupled to the modem unit.   
     
     
         9 . The mobile communication unit according to  claim 8 , wherein the modem unit comprises a baseband unit, the baseband unit comprising a central processing unit. 
     
     
         10 . The mobile communication unit according to  claim 9 , wherein the application unit comprises a memory unit containing an operation program comprising instructions for the operation of the central processing unit. 
     
     
         11 . The mobile communication unit according to  claim 7 , wherein in the embedded flash memory one or more of calibration data, network parameters, security data and debug data are stored. 
     
     
         12 . The mobile communication unit according to  claim 9 , wherein the baseband unit is arranged on a second semiconductor die. 
     
     
         13 . A mobile communication unit, comprising:
 a modem unit comprising a baseband unit, the baseband unit comprising a central processing unit, and a first memory unit configured to store therein one or more of calibration data, network parameter, security data and debug data; and   an application unit comprising a second memory unit configured to store therein an operation program for the operation of the central processing unit.   
     
     
         14 . The mobile communication unit according to  claim 13 , wherein the first memory unit comprises a flash memory. 
     
     
         15 . The mobile communication unit according to  claim 13 , wherein the modem unit resides on a first semiconductor die, and wherein a power management unit and the first memory unit also resides on the first semiconductor die. 
     
     
         16 . The mobile communication unit according to  claim 15 , wherein the baseband unit is arranged on a second semiconductor die. 
     
     
         17 . The mobile communication unit according to  claim 16 , further comprising:
 a radio frequency unit arranged on the second semiconductor die or on a third semiconductor die.   
     
     
         18 . A mobile communication unit, comprising:
 a modem unit; and   an application unit comprising a memory unit, wherein the memory unit is accessible by the modem unit and the application unit.   
     
     
         19 . The mobile communication unit according to  claim 18 , wherein the modem unit comprises a baseband unit, wherein the baseband unit comprises a central processing unit, wherein an operation program comprises instructions for operating the central processing unit is stored in the memory unit. 
     
     
         20 . The mobile communication unit according to  claim 18 , wherein the modem unit resides on a first semiconductor die, and wherein a power management unit and an embedded flash memory also resides on the first semiconductor die. 
     
     
         21 . The mobile communication unit according to  claim 20 , wherein one or more of calibration data, network parameters, security data and debug data are stored in the embedded flash memory. 
     
     
         22 . The mobile communication unit according to  claim 20 , wherein the modem unit further comprises a baseband unit arranged on a second semiconductor die. 
     
     
         23 . A method for producing a mobile communication unit, comprising:
 storing one or more of calibration data, network parameters, security data and debug data in a first memory unit;   fabricating a modem unit, wherein the modem unit comprises the first memory unit and a baseband unit, and wherein the baseband unit comprises a central processing unit;   storing an operation program for the operation of the central processing unit in a second memory; and   fabricating an application unit, wherein the application unit comprises the second memory unit.   
     
     
         24 . The method according to  claim 23 , further comprising:
 fabricating a first semiconductor die comprising a power management unit and the first memory unit.   
     
     
         25 . The method according to  claim 24 , further comprising:
 fabricating a second semiconductor die comprising the baseband unit.