Method of modifying surface of substrate for inkjet printing

Abstract

A method may include providing a surface modification inkjet head and a target inkjet head to be movable on a substrate, and forming a surface modification printed pattern by moving the surface modification inkjet head and ejecting surface modification ink onto the substrate. A target printed pattern may be formed by ejecting a target ink from the target inkjet head to the surface modification printed pattern and a metal wiring pattern may be formed on the substrate by removing the surface modification printed pattern.

1 . A method of modifying a surface of a substrate, the method comprising:
 arranging an inkjet printing device on a substrate, the inkjet printing device having a movable surface modification inkjet head and a movable target inkjet head; and   forming a surface modification printed pattern on the substrate by moving the surface modification inkjet head across the substrate and ejecting surface modification ink from the surface modification ink jet head to the substrate.   
     
     
         2 . The method of  claim 1 , wherein the surface modification inkjet head is moved to continuously form the surface modification printed pattern on the substrate. 
     
     
         3 . The method of  claim 1 , wherein surface modification ink contacts the surface of the substrate at a contact angle from about 20° to about 50°. 
     
     
         4 . The method of  claim 2 , further comprising:
 forming a target printed pattern on the surface modification printed pattern by moving the target inkjet head across the surface modification printed pattern and ejecting target ink from the target inkjet head onto the surface modification printed pattern.   
     
     
         5 . The method of  claim 4 , wherein a difference between surface energies of the surface modification ink and the substrate is smaller than a difference between surface energies of the target ink and the substrate. 
     
     
         6 . The method of  claim 4 , wherein the target inkjet head is moved to continuously form the target printed pattern on the surface modification printed pattern. 
     
     
         7 . The method of  claim 4 , further comprising:
 forming the continuous target printed pattern on the substrate by removing the surface modification printed pattern.   
     
     
         8 . The method of  claim 7 , wherein removing the surface modification printed pattern includes vaporizing the surface modification ink by at least one of natural drying and annealing. 
     
     
         9 . The method of  claim 7 , wherein the target printed pattern comprises a metal wiring pattern. 
     
     
         10 . The method of  claim 4 , wherein the substrate is a hydrophilic substrate coated with a hydrophobic material, and the target ink comprises a hydrophilic material. 
     
     
         11 . The method of  claim 10 , wherein the surface modification ink comprises a hydrophilic material. 
     
     
         12 . The method of  claim 10 , wherein the target ink comprises metal nanoparticles. 
     
     
         13 . The method of  claim 12 , wherein the metal nanoparticles comprise at least one of Au, Ag, and Cu. 
     
     
         14 . A method of forming a metal wiring pattern, the method comprising:
 providing a movable surface modification inkjet head and a movable target inkjet head on a substrate;   forming a surface modification printed pattern on the substrate by moving the surface modification inkjet head and ejecting surface modification ink from the surface modification inkjet head onto the substrate;   forming a target printed pattern on the surface modification printed pattern by moving the target inkjet head and ejecting target ink containing metal nanoparticles from the target inkjet head onto the surface modification printed pattern; and   forming the metal wiring pattern on the substrate by removing the surface modification printed pattern.   
     
     
         15 . The method of  claim 14 , wherein a difference between surface energies of the surface modification ink and the substrate is smaller than a difference between surface energies of the target ink and the substrate.