Biosensor manufacturing method
Abstract
A biosensor having a first conductive component is described, wherein the first conductive component includes at least one boundary formed by a first processing technique and at least one boundary formed by a second processing technique not the same as the first processing technique. The biosensor can also have a second conductive component including at least one boundary formed by the first processing technique and at least one boundary formed by a third processing technique not the same as the first processing technique. Further, the biosensor has a third conductive component including at least one boundary formed by the second processing technique and at least one boundary formed by the third processing technique not the same as the second processing technique.
Claims
exact text as granted — not AI-modified1 . A biosensor, comprising:
a first conductive component including at least one boundary formed by a first processing technique and at least one boundary formed by a second processing technique not the same as the first processing technique; a second conductive component including at least one boundary formed by the first processing technique and at least one boundary formed by a third processing technique not the same as the first processing technique; and a third conductive component including at least one boundary formed by the second processing technique and at least one boundary formed by the third processing technique not the same as the second processing technique.
2 . The biosensor of claim 1 , wherein the first processing technique includes at least one technique selected from the group consisting of laser ablation, stamping, cutting, and etching.
3 . The biosensor of claim 1 , wherein the second processing technique includes at least one technique selected from the group consisting of laser ablation, stamping, cutting, and etching.
4 . The biosensor of claim 1 , wherein the third processing technique includes at least one technique selected from the group consisting of laser ablation, stamping, cutting, and etching.
5 . The biosensor of claim 1 , wherein the first processing technique includes laser ablation at a first ablative beam width and the second processing technique includes laser ablation at a second ablative beam width, wherein the first beam width and the second beam width are not the same.
6 . The biosensor of claim 5 , wherein the first ablative beam width is at least approximately 20 micro-meters.
7 . The biosensor of claim 5 , wherein the second ablative beam width is at least approximately 100 micro-meters.
8 . The biosensor of claim 5 , wherein at least one laser ablation processing technique removes substantially all conductive material between adjacent conductive components.
9 . The biosensor of claim 1 , wherein the first processing technique includes laser ablation using a first type of laser and the second processing technique includes laser ablation using a second type of laser, wherein the first type of laser and the second type of laser are not the same.
10 . The biosensor of claim 9 , wherein the first or second type of laser is selected from the group consisting of a solid-state laser, a copper vapor laser, a diode laser, a carbon dioxide laser, and an excimer laser.
11 . The biosensor of claim 9 , wherein the first or second type of laser operates in a region selected from at least one of an ultraviolet, a visible, and an infrared region.
12 . The biosensor of claim 1 , wherein the first processing technique includes laser ablation using a first laser operating at a first power and the second processing technique includes laser ablation using a second laser operating at a second power, wherein the first power and the second power are not the same.
13 . The biosensor of claim 12 , wherein the first or second laser power is in the range of about 10 to about 100 watts.
14 . The biosensor of claim 1 , wherein the first processing technique includes forming a single kerf and the second processing technique includes forming a plurality of kerfs.
15 . The biosensor of claim 1 , wherein the first conductive component is contacted by at least one chemical component.
16 . The biosensor of claim 15 , wherein the at least one chemical component includes at least one compound selected from the group consisting of potassium ferricyanide, ruthenium hexamine, glucose oxidase and glucose dehydrogenase.
17 . The biosensor of claim 1 , wherein at least one of the first conductive component, the second conductive component, and the third conductive component is formed from a semi-conductive material.
18 - 54 . (canceled)
55 . A biosensor, comprising:
a first electrode and a second electrode, wherein each said electrode includes at least one first boundary formed by a first processing technique and at least one second boundary; and a diffusion barrier positioned between the first electrode and the second electrode and contiguous with the at least one second boundary of each said electrode, wherein the diffusion barrier is formed by a second processing technique not the same as the first processing technique.
56 - 66 . (canceled)
67 . The biosensor of claim 55 , wherein the width of the diffusion barrier is at least approximately 100 micro-meters.
68 . The biosensor of claim 55 , wherein the diffusion barrier is formed between a working electrode and a counter electrode.
69 . The biosensor of claim 55 , wherein the diffusion barrier is formed between a working electrode and a fill-detect electrode.
70 . The biosensor of claim 55 , wherein the diffusion barrier is formed between a fill-detect anode and a fill-detect cathode.
71 . The biosensor of claim 55 , wherein the first electrode is contacted by at least one chemical component.
72 . The biosensor of claim 71 , wherein the at least one chemical component includes at least one compound selected from the group consisting of potassium ferricyanide, ruthenium hexamine, glucose oxidase and glucose dehydrogenase.
73 - 90 . (canceled)Join the waitlist — get patent alerts
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