US2012125570A1PendingUtilityA1

Heat dissipating device

33
Assignee: WANG FENG-KUPriority: Nov 19, 2010Filed: Apr 6, 2011Published: May 24, 2012
Est. expiryNov 19, 2030(~4.4 yrs left)· nominal 20-yr term from priority
H10W 40/73H10W 40/43F28D 15/0233F28D 15/02
33
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Claims

Abstract

A heat dissipating device is disclosed, which includes a fan body, an upper fan cover, and a lower fan cover. The upper fan cover and the lower fan cover are assembled on the fan body. The fan body has an airflow outlet. The upper fan cover includes an upper cover front portion, and plural upper cover recessions disposed at the upper cover front portion. The upper cover recessions are located in front of the airflow outlet.

Claims

exact text as granted — not AI-modified
1 . A heat dissipating device, comprising:
 a fan body having an airflow outlet;   an upper fan cover assembled on the fan body, wherein the upper fan cover comprises:
 an upper cover front portion, and 
 a plurality of upper cover recessions disposed at the upper cover front portion and located in front of the airflow outlet; and 
   a lower fan cover assembled on the fan body.   
     
     
         2 . The heat dissipating device of  claim 1 , wherein each of the upper cover recessions comprises a first bottom and two first side walls located on two sides of the first bottom. 
     
     
         3 . The heat dissipating device of  claim 2 , further comprising a heat pipe with a first end contacting a heat source and a second end contacting the first bottoms. 
     
     
         4 . The heat dissipating device of  claim 3 , wherein the lower fan cover comprises:
 a lower cover front portion; and   a plurality of lower cover recessions disposed at the lower cover front portion and located in front of the airflow outlet.   
     
     
         5 . The heat dissipating device of  claim 4 , wherein each of the lower cover recessions comprises a second bottom and two second side walls located on two sides of the second bottom, and the second end of the heat pipe is in contact with the second bottoms. 
     
     
         6 . The heat dissipating device of  claim 5 , further comprising a heat plate disposed at the first end of the heat pipe to contact the heat source. 
     
     
         7 . The heat dissipating device of  claim 6 , wherein the upper fan cover further comprises an extending portion, and the extending portion is in contact with another heat source. 
     
     
         8 . The heat dissipating device of  claim 1 , wherein the upper fan cover further comprises an extending portion, and the extending portion is in contact with a heat source. 
     
     
         9 . The heat dissipating device of  claim 8 , wherein the lower fan cover comprises:
 a lower cover front portion; and   a plurality of lower cover recessions disposed at the lower cover front portion and located in front of the airflow outlet.   
     
     
         10 . The heat dissipating device of  claim 9 , further comprising a heat pipe with a first end contacting a heat source and a second end located between the upper cover recessions and the lower cover recessions. 
     
     
         11 . The heat dissipating device of  claim 10 , further comprising a heat pipe with a first end contacting a heat source and a second end contacting the first bottoms. 
     
     
         12 . The heat dissipating device of  claim 11 , wherein each of the upper cover recessions comprises a first bottom and two first side walls located on two sides of the first bottom, and the second end of the heat pipe is in contact with the first bottoms. 
     
     
         13 . The heat dissipating device of  claim 12 , wherein each of the lower cover recessions comprises a second bottom and two second side walls located on two sides of the second bottom, and the second end of the heat pipe is in contact with the second bottoms. 
     
     
         14 . The heat dissipating device of  claim 1 , wherein the lower fan cover comprises:
 a lower cover front portion; and   a plurality of lower cover recessions disposed at the lower cover front portion and located in front of the airflow outlet.   
     
     
         15 . The heat dissipating device of  claim 14 , wherein a material of the upper fan cover and the lower fan cover is copper or aluminum. 
     
     
         16 . The heat dissipating device of  claim 15 , wherein each of the upper cover recessions comprises a first bottom and two first side walls located on two sides of the first bottom, and each of the lower cover recessions comprises a second bottom and two second side walls located on two sides of the second bottom, and the first bottoms are opposite to the second bottoms. 
     
     
         17 . The heat dissipating device of  claim 16 , wherein the upper fan cover further comprises an extending portion, and the extending portion is in contact with a heat source.

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