Heat exchange circuit

Abstract

The invention relates to a circuit for promoting heat exchange to/from a fluid. The circuit comprises two walls sealed to form a duct able to contain a flow of fluid. Each wall comprises, during use, a pattern of corrugations having, at least along sections, a preferential direction. The pattern of corrugations of one wall is positioned to be superimposed at least partially on the one of the other wall so as to form an angle γ between the preferential directions, γ ranging between 70° and 110°. At least one wall is designed to transfer heat to/from the liquid. The invention relates moreover to a device for use with the heat exchange circuit. The device comprises two plates, at least one of which is thermally active and which are shaped to obtain intimate contact with the walls of the circuit, at least in the zones with the corrugations.

1 . Circuit ( 30 ) for heat exchange to/from a physiological fluid, comprising at least two walls ( 32 ,  33 ,  34 ) which rest on each other and are sealed so as to form at least one duct ( 36 ) suitable for containing a flow of said physiological fluid;
 wherein each of the at least two walls ( 32 ,  33 ,  34 ) comprises, in use, a pattern of corrugations ( 320 ,  330 ,  340 ) having, at least along sections, a preferential direction, the pattern of corrugations ( 320 ) of one wall ( 32 ) being positioned so as to be superimposed at least partially on the pattern of corrugations ( 340 ) of the other wall ( 34 ) so as to form an angle γ between the respective preferential directions, wherein the angle γ ranges between 70° and 110°; and   wherein at least one of the walls ( 32 ,  33 ,  34 ) is suitable for transferring heat to/from the fluid flow.   
     
     
         2 . Circuit ( 30 ) according to  claim 1 , wherein the two walls ( 32 ,  34 ) are perfectly identical to one another. 
     
     
         3 . Circuit ( 30 ) according to  claim 1 , wherein at least one wall ( 32 ;  34 ) has a thickness (s) which is small in relation to the amplitude (λ) of the corrugations such that the same pattern of corrugations appears on both sides of the wall ( 32 ;  34 ). 
     
     
         4 . Circuit ( 30 ) according to  claim 1 , wherein at least one wall ( 32 ;  34 ) has a thickness (s) which is large in relation to the amplitude (λ) of the corrugations such that the pattern of corrugations appears only on the inner side of the wall ( 32 ;  34 ), while the outer side is smooth. 
     
     
         5 . Circuit ( 30 ) according to  claim 1 , wherein at least one wall ( 32 ;  34 ) is, before use, smooth, i.e. without any pattern of corrugations. 
     
     
         6 . Circuit ( 30 ) according to  claim 4 , wherein the at least one wall ( 32 ;  34 ) with a large thickness is made of metallic material. 
     
     
         7 . Circuit ( 30 ) according to  claim 1 , comprising three walls ( 32 ,  33 ,  34 ) so as to define two different ducts ( 36 ′,  36 ″) separate from each other and suitable for containing two different fluid flows; the outer walls ( 32 ,  34 ) having a large thickness and low thermal conductivity coefficient, the inner wall ( 33 ) having a small thickness and a high thermal conductivity coefficient. 
     
     
         8 . Thermal device ( 50 ) suitable for cooperating with a heat exchange circuit ( 30 ) according to  claim 1 , the thermal device ( 50 ) comprising two plates ( 52 ,  54 ) at least one of which being thermally active, the plates ( 52 ,  54 ) being shaped so as to obtain intimate contact with the walls ( 32 ,  34 ) of the heat exchange circuit ( 30 ), at least in the zones coinciding with the respective patterns of corrugations ( 320 ,  340 ). 
     
     
         9 . Thermal device ( 50 ) according to the preceding claim, wherein each of the plates ( 52 ,  54 ) comprises a pattern of corrugations ( 520 ,  540 ) identical to the pattern of corrugations ( 320 ,  340 ) of the wall ( 32 ,  34 ) with which it is intended to come into contact, so as to avoid the presence of air between the wall ( 32 ,  34 ) and the plate ( 52 ,  54 ). 
     
     
         10 . Thermal device ( 50 ) according to  claim 8 , wherein the thermally active plate ( 52 ;  54 ) is of the type which can release heat to the wall of the circuit ( 30 ); of the type which can absorb heat from the wall of the circuit ( 30 ); or of the type which can alternatively release or absorb heat to/from the wall of the circuit ( 30 ). 
     
     
         11 . Thermal device ( 50 ) according to the preceding claim, wherein the thermally active plate ( 52 ;  54 ) comprises resistors or Peltier cells. 
     
     
         12 . Thermal device ( 50 ) suitable for cooperating with a heat exchange circuit ( 30 ) according to  claim 5 , the thermal device ( 50 ) comprising two plates ( 52 ,  54 ) at least one of which being thermally active, the plates ( 52 ,  54 ) being shaped so as to obtain intimate contact with walls ( 32 ,  34 ) of the heat exchange circuit ( 30 ), at least in the zones coinciding with the respective patterns of corrugations ( 320 ,  340 ), the thermal device ( 50 ) further comprising vacuum application means ( 56 ) and at least one suction plate ( 52 ;  54 ). 
     
     
         13 . Thermal device ( 50 ) according to the preceding claim, wherein the suction plate comprises suction conduits ( 58 ) arranged in arrays on the bottom of the valleys of the corrugations of the suction plate ( 52 ;  54 ) or is made of porous material. 
     
     
         14 . Thermal device ( 50 ), suitable for cooperating with a heat exchange circuit ( 30 ) according to  claim 4 , the thermal device ( 50 ) comprising two plates ( 52 ,  54 ) at least one of which being thermally active, the plates ( 52 ,  54 ) being shaped so as to obtain intimate contact with walls ( 32 ,  34 ) of the heat exchange circuit ( 30 ), at least in the zones coinciding with the respective patterns of corrugations ( 320 ,  340 ), at least one thermally active plate with a smooth surface, i.e. suitable for obtaining the desired intimate contact with the smooth outer side of the wall ( 32 ;  34 ) of the circuit ( 30 ). 
     
     
         15 . Assembly comprising a heat exchange circuit ( 30 ) according to  claim 1  and a thermal device ( 50 ) having two plates ( 52 ,  54 ) at least one of which being thermally active, the plates ( 52 ,  54 ) being shaped so as to obtain intimate contact with the walls ( 32 ,  34 ) of the heat exchange circuit ( 30 ), at least in the zones coinciding with the respective patterns of corrugations ( 320 ,  340 ), wherein the walls ( 32 ,  34 ) of the circuit ( 30 ) are in intimate contact with the plates ( 52 ,  54 ) of the thermal device ( 50 ) at least in the zones coinciding with the respective patterns of corrugations ( 320 ,  340 ). 
     
     
         16 . Assembly comprising a heat exchange circuit ( 30 ) according to  claim 5  and a thermal device ( 50 ) having two plates ( 52 ,  54 ) at least one of which being thermally active, the plates ( 52 ,  54 ) being shaped so as to obtain intimate contact with the walls ( 32 ,  34 ) of the heat exchange circuit ( 30 ), at least in the zones coinciding with the respective patterns of corrugations ( 320 ,  340 ), the thermal device ( 50 ) having vacuum application means ( 56 ) and at least one suction plate ( 52 ,  54 ), wherein the vacuum application means ( 56 ) sucks off the air trapped between the smooth wall ( 32 ;  34 ) and the corrugated plate ( 52 ;  54 ) such that the wall ( 32 ;  34 ) fully adheres against the plate ( 52 ;  54 ) so as to reproduce exactly the corrugations thereof. 
     
     
         17 . Method for obtaining an assembly according to  claim 15 , comprising the steps of:
 Providing a heat exchange circuit ( 30 ) having at least two walls ( 32 ,  33 ,  34 ) for heat exchange to/from a physiological fluid, comprising at least two walls ( 32 ,  33 ,  34 ) which rest on each other and are sealed so as to form at least one duct ( 36 ) suitable for containing a flow of said physiological fluid;   wherein at least one of the walls ( 32 ,  33 ,  34 ) is suitable for transferring heat to/from the fluid flow;   Providing a thermal device ( 50 ) having two plates ( 52 ,  54 ) at least one of which being thermally active, the plates ( 52 ,  54 ) being shaped so as to obtain intimate contact with the walls ( 32 ,  34 ) of the heat exchange circuit ( 30 ), at least in the zones coinciding with the respective patterns of corrugations ( 320 ,  340 );   Positioning the circuit ( 30 ) between the two plates ( 52 ,  54 ) of the thermal device ( 50 ) so as to let the peaks of the corrugations of the plates ( 52 ,  54 ) fit perfectly inside the peaks of the corrugations of the walls ( 32 ,  34 ), and the valleys of the corrugations in the plates ( 52 ,  54 ) fit perfectly inside the valleys of the corrugations in the walls ( 32 ,  34 ).   
     
     
         18 . Method for obtaining an assembly according to  claim 16 , comprising the steps of:
 Providing a heat exchange circuit ( 30 ) having at least two walls ( 32 ,  33 ,  34 ) having at least two walls ( 32 ,  33 ,  34 ) for heat exchange to/from a physiological fluid, comprising at least two walls ( 32 ,  33 ,  34 ) which rest on each other and are sealed so as to form at least one duct ( 36 ) suitable for containing a flow of said physiological fluid;   wherein at least one of the walls ( 32 ,  33 ,  34 ) is suitable for transferring heat to/from the fluid flow, wherein at least one wall ( 32 ,  34 ) is, before use, smooth, i.e., without any pattern of corrugations;   Providing a thermal device ( 50 ) having two plates ( 52 ,  54 ) at least one of which being thermally active, the plates ( 52 ,  54 ) being shaped so as to obtain intimate contact with the walls ( 32 ,  34 ) of the heat exchange circuit ( 30 ), at least in the zones coinciding with the respective patterns of corrugations ( 320 ,  340 ), suitable for cooperating with a heat exchange circuit ( 30 ), the thermal device ( 50 ) comprising vacuum application means ( 56 ) and at least one suction plate ( 52 ,  54 );   Positioning the circuit ( 30 ) between the two plates ( 52 ,  54 ) of the thermal device ( 50 );   Activating the vacuum application means ( 56 ) so as to suck off the air trapped between the smooth wall ( 32 ;  34 ) and the corrugated plate ( 52 ;  54 ).