Light emitting device and method for enhancing light extraction thereof

Abstract

A method for enhancing light extraction of a light emitting device is disclosed. The method includes the steps of: providing a site layer on the light emitting device; placing a protection layer on the site layer; forming an array of pores through the protection layer and the site layer; and growing on the site layer an oxide layer, having a plurality of rods, each of which is formed in one of the pores. The shapes of the rods can be well controlled by adjusting reactive temperature, time and N 2 /H 2 concentration ratio of atmosphere such that the shape and light escape angle of the rods can be changed.

1 . A method for enhancing light extraction of a light emitting device, comprising the steps of:
 providing a site layer on the light emitting device;   placing a protection layer on the site layer;   forming an array of pores through the protection layer and the site layer; and   growing a plurality of oxide rods on the light emitting substrate, each of which is formed in one of the pores;   wherein the site layer and the protection layer are formed of different materials, and wherein the shapes of the rods are controlled by adjusting reactive temperature, time and N 2 /H 2  concentration ratio of atmosphere such that the shape and light escape angle of the rods can be are changed.   
     
     
         2 . The method according to  claim 1 , wherein the oxide rods comprise zinc oxide (ZnO), silicon dioxide (SiO 2 ), titanium dioxide (TiO 2 ), or aluminum oxide (Al 2 O 3 ). 
     
     
         3 . The method according to  claim 1 , wherein the oxide rods are formed by hydrothermal treatment, sol-gel method, electro-plating, thermal evaporation, chemical vapor deposition (CVD), or molecular beam epitaxy (MBE). 
     
     
         4 . The method according to  claim 1 , wherein the site layer comprises ITO, Ni/Au, NiO/Au, p-ZnO, or ZnO. 
     
     
         5 . The method according to  claim 1 , wherein the protection layer comprises photoresist material or dielectric material. 
     
     
         6 . The method according to  claim 1 , wherein the atmosphere temperature is higher than 200°. 
     
     
         7 . The method according to  claim 1 , wherein the atmosphere comprises nitrogen, hydrogen, or a mixture thereof. 
     
     
         8 . The method according to  claim 1 , wherein the atmosphere has a nitrogen/hydrogen concentration ratio larger than 1. 
     
     
         9 . The method according to  claim 1 , wherein the rods have a nanostructure or a microstructure. 
     
     
         10 . The method according to  claim 1 , wherein the rods have a shape of a hexagonal pyramid or a truncated hexagonal pyramid. 
     
     
         11 . The method according to  claim 1 , wherein the rod has a bottom surface with a diameter ranging from 100 nm˜1 μm. 
     
     
         12 . The method according to  claim 1 , wherein the pores are formed by wet etching process, dry etching process, photolithography and exposure development process, laser cutting process, or electron beam writing process. 
     
     
         13 .- 24 . (canceled)