Tec device and electrical device applying the tec device

Abstract

A Thermoelectric Cooling (TEC) device is provided, which includes a TEC module, a first heat exchange device, and a second heat exchange device. The TEC module includes a cold end and a hot end corresponding to the cold end. The first heat exchange device is disposed at the cold end of the TEC module, and is configured to exchange heat with a medium surrounding the cold end of the TEC module. The second heat exchange device is disposed at the hot end of the TEC module; the second heat exchange device includes an evaporation end and a condensation end; a cooling medium is disposed in the second heat exchange device, and is configured to perform heat exchange at the evaporation end and the condensation end in a phase transition manner; and the evaporation end adjoins the hot end of the TEC module.

1 . A Thermoelectric Cooling (TEC) device, comprising a TEC module, a first heat exchange device, and a second heat exchange device, wherein
 the TEC module comprises a cold end and a hot end;   the first heat exchange device is disposed at the cold end of the TEC module, and is configured to exchange heat with a medium surrounding the cold end of the TEC module;   the second heat exchange device is disposed at the hot end of the TEC module; the second heat exchange device comprises an evaporation end and a condensation end; the evaporation end adjoins or contacts the hot end of the TEC module, and the condensation end is away from the evaporation end; and   a cooling medium is accommodated in the second heat exchange device, and the cooling medium is configured to perform heat exchange at the evaporation end and the condensation end in a phase transition manner.   
     
     
         2 . The TEC device according to  claim 1 , wherein the first heat exchange device is a heat sink fin array, and is made of copper, aluminum, or heat conducting graphite. 
     
     
         3 . The TEC device according to  claim 1 , further comprising: a cold end fan, disposed at an external side of the first heat exchange device. 
     
     
         4 . The TEC device according to  claim 1 , wherein the first heat exchange device comprises a heat dissipation block, a first heat conducting member, a temperature control phase transition module, and a second heat conducting member;
 the heat dissipation block is disposed at the cold end of the TEC module;   an end of the first heat conducting member is disposed on the heat dissipation block, and another end of the first heat conducting member is connected to the temperature control phase transition module; and   the second heat conducting member is disposed on the temperature control phase transition module through an end.   
     
     
         5 . The TEC device according to  claim 4 , wherein the first heat conducting member is a heat pipe, a thermal siphon, or a vapor cavity; and
 the first heat conducting member comprises an evaporation end and a condensation end, the condensation end of the first heat conducting member is disposed on the heat dissipation block, and the evaporation end of the first heat conducting member is connected to the temperature control phase transition module.   
     
     
         6 . The TEC device according to  claim 4 , wherein the second heat conducting member is a heat pipe, a thermal siphon, or a vapor cavity; and
 the second heat conducting member comprises a vapor end and a condensation end, and the second heat conducting member is disposed on the temperature control phase transition module through the condensation end.   
     
     
         7 . The TEC device according to  claim 1 , wherein the TEC module further comprises a heat conducting plate, the heat conducting plate is disposed at the hot end of the TEC module, and the evaporation end of the second heat exchange device inserts in and is fitted on the heat conducting plate of the TEC module. 
     
     
         8 . The TEC device according to  claim 1 , wherein the second heat exchange device further comprises multiple heat dissipation plates, and the heat dissipation plates are disposed between the evaporation end and the condensation end with uniform intervals. 
     
     
         9 . An electrical device, comprising a cabinet and a Thermoelectric Cooling (TEC) device disposed on the cabinet, wherein the cabinet comprises a cabinet body, and the TEC device comprises a TEC module, a first heat exchange device, and a second heat exchange device;
 the TEC module comprises a cold end and a hot end;   the first heat exchange device is disposed at the cold end of the TEC module and connected to the cabinet body, and is configured to exchange heat with a medium surrounding the cold end of the TEC module;   the second heat exchange device is disposed at the hot end of the TEC module; the second heat exchange device comprises an evaporation end and a condensation end; the evaporation end adjoins or contacts the hot end of the TEC module, and the condensation end is away from the evaporation end; and   a cooling medium is accommodated in the second heat exchange device, and the cooling medium is configured to perform heat exchange at the evaporation end and the condensation end in a phase transition manner.   
     
     
         10 . The electrical device according to  claim 9 , wherein the first heat exchange device is a heat sink fin array, and is made of copper, aluminum, or heat conducting graphite. 
     
     
         11 . The electrical device according to  claim 9 , wherein the first heat exchange device comprises a heat dissipation block, a first heat conducting member, a temperature control phase transition module, and a second heat conducting member;
 the heat dissipation block is disposed at the cold end of the TEC module;   an end of the first heat conducting member is disposed on the heat dissipation block, and another end of the first heat conducting member is connected to the temperature control phase transition module;   the temperature control phase transition module is disposed on the cabinet; and   an end of the second heat conducting member is disposed on the temperature control phase transition module, and another end of the second heat conducting member stretches into the cabinet.   
     
     
         12 . The electrical device according to  claim 11 , wherein the first heat conducting member is a heat pipe, a thermal siphon, or a vapor cavity; and
 the first heat conducting member comprises an evaporation end and a condensation end, the condensation end of the first heat conducting member is disposed on the heat dissipation block, and the evaporation end of the first heat conducting member is connected to the temperature control phase transition module.   
     
     
         13 . The electrical device according to  claim 11 , wherein the second heat conducting member is a heat pipe, a thermal siphon, or a vapor cavity; and
 the second heat conducting member comprises an evaporation end and a condensation end, the second heat conducting member is disposed on the temperature control phase transition module through the condensation end, and the evaporation end of the second heat conducting member is located in the cabinet.   
     
     
         14 . The electrical device according to  claim 9 , wherein the TEC module further comprises a heat conducting plate, the heat conducting plate is disposed at the hot end of the TEC module, and the evaporation end of the second heat exchange device is fixedly inserted on the heat conducting plate of the TEC module. 
     
     
         15 . The electrical device according to  claim 9 , wherein the second heat exchange device further comprises multiple heat dissipation plates, and the heat dissipation plates are disposed between the evaporation end and the condensation end with uniform intervals.